JPH0482706A - Wood flooring material for heating floor - Google Patents
Wood flooring material for heating floorInfo
- Publication number
- JPH0482706A JPH0482706A JP19741090A JP19741090A JPH0482706A JP H0482706 A JPH0482706 A JP H0482706A JP 19741090 A JP19741090 A JP 19741090A JP 19741090 A JP19741090 A JP 19741090A JP H0482706 A JPH0482706 A JP H0482706A
- Authority
- JP
- Japan
- Prior art keywords
- boiling point
- flooring material
- wood
- high boiling
- point solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 46
- 238000009408 flooring Methods 0.000 title claims abstract description 44
- 238000010438 heat treatment Methods 0.000 title claims description 12
- 239000002023 wood Substances 0.000 title abstract description 32
- 238000009835 boiling Methods 0.000 claims abstract description 34
- 239000002904 solvent Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011120 plywood Substances 0.000 abstract description 6
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 3
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 3
- 239000007864 aqueous solution Substances 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Floor Finish (AREA)
Abstract
Description
本発明は、暖房床に用いられる木質床材に関するもので
ある。The present invention relates to a wooden flooring material used for heated floors.
床面にヒータを埋設したり、温水等を通すパイプを埋設
したりして、床面がらの発熱で暖房をおこなうようにし
た床暖房のシステムが従来から提供されている。そして
このような暖房床の床材としては、従来と同様に木材の
合板を基材とし、表面に木質化粧単板を貼って得られる
木質床材が一殻に使用されている。このような木質床材
は、木材をスライスしたベニア単板を接着剤で接着する
ことによって基材となる合板を作成すると共に、この基
材に木質化粧単板を接着剤で接着することによって製造
されており、製造された段階では比較的含水率が高い。BACKGROUND OF THE INVENTION Floor heating systems have conventionally been provided in which heating is performed using heat generated from the floor surface by burying a heater in the floor surface or burying pipes for passing hot water, etc. As a flooring material for such a heated floor, as in the past, a wooden flooring material obtained by using wood plywood as a base material and pasting a decorative wood veneer on the surface is used. This kind of wood flooring is manufactured by creating plywood as a base material by gluing veneer veneers sliced from wood with adhesive, and then gluing decorative wood veneers to this base material with adhesive. It has a relatively high moisture content at the manufactured stage.
しかし、この木質床材を暖房床に用いると、床暖房の際
のヒータや発熱パイプからの発熱で加熱されて乾燥し、
木質床材の含水率が低下することになる。そして木質床
材は含水率が高いと膨張し、含水率が低いと収縮するた
めに、このような含水率の変化で木質床材の寸法が変化
し、木質床材間に目すきが発生したり、木質床材に反り
などの変形が発生したりする等の、問題が多売するもの
であった。
本発明は上記の点に鑑みて為されたものであり、含水率
の変化による寸法変化を抑制し、目すきゃ変形等が発生
することを防ぐことのできる床暖房用木質床材を提供す
ることを目的とするものである。However, when this wood floor material is used as a heated floor, it is heated and dried by the heat generated from the heater and heating pipes during floor heating.
This will reduce the moisture content of the wood flooring. Wood flooring expands when the moisture content is high and contracts when the moisture content is low, so this change in moisture content changes the dimensions of the wooden flooring and creates gaps between the wooden flooring materials. Problems such as warping and other deformation of the wooden flooring material were common. The present invention has been made in view of the above points, and an object of the present invention is to provide a wooden flooring material for floor heating that can suppress dimensional changes due to changes in moisture content and prevent the occurrence of deformation of the gaps and the like. The purpose is to
本発明に係る暖房床用木質床材は、床面から発熱させて
暖房をおこなうようにした暖房床の木質床材において、
木質床材には水より沸点の高い高沸点溶剤を含有させて
成ることを特徴とするものである。The wooden flooring material for a heated floor according to the present invention is a wooden flooring material for a heated floor that generates heat from the floor surface to perform heating.
The wooden flooring material is characterized by containing a high boiling point solvent that has a boiling point higher than that of water.
木質床材に含有させた高沸点溶剤は蒸発しにくいために
、床暖房の際に木質床材が加熱されて含水率が低下して
も木質床材内には高沸点溶剤が残留し、収縮を抑制して
木質床材の寸法変化を小さく抑えることができる。The high-boiling point solvent contained in the wood flooring material is difficult to evaporate, so even if the wood flooring material is heated during floor heating and its moisture content decreases, the high-boiling point solvent remains inside the wood flooring material, causing shrinkage. It is possible to suppress the dimensional change of the wooden flooring material.
以下本発明を実施例によって詳述する。
木質床材Ａは第１図に示すように、合板で形成される基
材１の表面に木質化粧単板２を接着して作成されるもの
であり、本発明ではこの木質床材Ａに、特にその基材１
に水よりも沸点が高い高沸点溶剤を浸透させて含有させ
るようにしたものである。高沸点溶剤としては特に限定
されるものではないが、常温で液状で、木材内に浸透さ
せ易い粘度を有し、水とよく溶解するもの、例えばポリ
エチレングリコール（ＰＥＧ）やエチレングリコール（
ＥＧ）などが好ましい。
木質床材Ａに高沸点溶剤を含有させるにあたっては、ま
ずラワン材などの原木丸太を高沸点溶剤を水に対して５
〜５０重量％添加した煮沸水溶液に浸漬して煮沸した後
に乾燥する０次に高沸点溶剤を浸透させたこの原木丸太
をスライスして乾燥することによってベニア単板を作成
し、高沸点溶剤を接着剤中に５〜３０重量％添加した尿
素系やメラミン系の水溶性接着剤を用いてベニア単板を
積層接着することによって、高沸点溶剤を浸透させた合
板を得る。そしてこの合板を基材１とし、高沸点溶剤を
接着剤中に５〜３０重量％添加した尿素系やゴム系の接
着剤を用いて木質化粧単板２を接着することによって、
木質化粧単板２にも高沸点溶剤を浸透させる。
上記のようにして高沸点溶剤を含有させた木質床材Ａは
、暖房床の床材として使用されるものであり、例えば床
下地にヒータや発熱バイブを埋設してこの上に木質床材
Ａを敷き並べることによって暖房床を形成することがで
き、また木質床材Ａ内にヒータ等を内蔵してこの木質床
材Ａを一般の床下地上に敷き並べることによって暖房床
を形成することができる。そしてこの木質床材Ａには高
沸点溶剤が含有されているために、床暖房の際の加熱で
木質床材Ａの含水率が低下しても、沸点が高くて蒸発し
にくい高沸点溶剤が木質床材Ａ内に残留しており、木質
床材Ａの収縮を抑制することができる（基材１の収縮は
１／３程度に抑制される）、そしてこのように収縮を抑
制して寸法変化が小さくなる結果、木質床材Ａは変形が
小さくなって反りやあばれが発生することを防止するこ
とができる。また高沸点溶剤が含有されているために、
木質床材Ａにはカビが発生しにくくなるという効果もあ
る。The present invention will be explained in detail below with reference to Examples. As shown in FIG. 1, the wooden flooring A is made by adhering a wooden decorative veneer 2 to the surface of a base material 1 made of plywood, and in the present invention, this wooden flooring A includes: Especially the base material 1
A high boiling point solvent, which has a boiling point higher than that of water, is permeated into the water. High boiling point solvents are not particularly limited, but they are liquid at room temperature, have a viscosity that allows them to easily penetrate into wood, and dissolve well in water, such as polyethylene glycol (PEG) and ethylene glycol (
EG) etc. are preferred. In order to incorporate a high boiling point solvent into the wood flooring material A, first, raw wood logs such as lauan wood are mixed with a high boiling point solvent in water for 50 minutes.
This raw wood log impregnated with a zero-order high-boiling point solvent is immersed in a boiling aqueous solution containing ~50% by weight, boiled, and then dried.The log is sliced and dried to create a veneer veneer, and the high-boiling point solvent is bonded. Plywood impregnated with a high boiling point solvent is obtained by laminating and bonding veneer veneers using a urea-based or melamine-based water-soluble adhesive added in an amount of 5 to 30% by weight. Then, by using this plywood as the base material 1 and gluing the decorative wood veneer 2 using a urea-based or rubber-based adhesive containing 5 to 30% by weight of a high boiling point solvent,
The high boiling point solvent is also permeated into the decorative wood veneer 2. The wooden flooring material A containing a high boiling point solvent as described above is used as a flooring material for a heated floor.For example, a heater or heat-generating vibrator is buried in the floor base and the wooden flooring material A is placed on top of this. A heated floor can be formed by laying the wood flooring materials A, and a heating floor can be formed by installing a heater etc. in the wooden flooring material A and laying this wooden flooring material A on a general subfloor. . Since this wood flooring material A contains a high boiling point solvent, even if the moisture content of the wood flooring material A decreases due to heating during floor heating, the high boiling point solvent has a high boiling point and is difficult to evaporate. It remains in the wooden flooring material A, and can suppress the shrinkage of the wooden flooring material A (the shrinkage of the base material 1 is suppressed to about 1/3). As a result of the smaller change, the wooden flooring material A is less deformed and can be prevented from warping or cracking. Also, because it contains high boiling point solvents,
Wood flooring material A also has the effect of making it difficult for mold to grow.
上述のように本発明にあっては、木質床・材に水より沸
点の高い高沸点溶剤を含有させであるので、木質床材に
含有させた高沸点溶剤は蒸発しにくいために、床暖房の
際に木質床材が加熱されて含水率が低下しても木質床材
内には高沸点溶剤が残留することになり、−収縮を抑制
して木質床材の寸法変化を小さく抑えることができ、木
質床材間に目すきが発生したり、木質床材に反りなどの
変形が発生したりすることを防止することができるもの
である。As mentioned above, in the present invention, the wooden floor/material contains a high boiling point solvent that has a boiling point higher than water, so the high boiling point solvent contained in the wooden floor material is difficult to evaporate, so it is difficult to evaporate. Even when the wood flooring is heated and its moisture content decreases, high boiling point solvents remain inside the wood flooring, which can suppress shrinkage and keep dimensional changes in the wood flooring to a minimum. This can prevent gaps between the wooden flooring materials and deformation such as warping of the wooden flooring materials.
Claims (1)
房床の木質床材において、木質床材には水より沸点の高
い高沸点溶剤を含有させて成ることを特徴とする暖房床
用木質床材。(1) A wooden floor material for a heated floor that generates heat from the floor surface to perform heating, characterized in that the wooden floor material contains a high boiling point solvent that has a boiling point higher than that of water. flooring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197410A JP2731287B2 (en) | 1990-07-25 | 1990-07-25 | Wood flooring for heating floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197410A JP2731287B2 (en) | 1990-07-25 | 1990-07-25 | Wood flooring for heating floor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0482706A true JPH0482706A (en) | 1992-03-16 |
| JP2731287B2 JP2731287B2 (en) | 1998-03-25 |
Family
ID=16374053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2197410A Expired - Lifetime JP2731287B2 (en) | 1990-07-25 | 1990-07-25 | Wood flooring for heating floor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2731287B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7131456B2 (en) | 2003-03-28 | 2006-11-07 | Samsung Electronics Co., Ltd. | Mass flow controller |
| CN111113616A (en) * | 2019-12-30 | 2020-05-08 | 湖州练市皇盛木业有限公司 | Processing technology for heating floor board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6391436A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Works Ltd | Decorative panel for space heating |
-
1990
- 1990-07-25 JP JP2197410A patent/JP2731287B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6391436A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Works Ltd | Decorative panel for space heating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7131456B2 (en) | 2003-03-28 | 2006-11-07 | Samsung Electronics Co., Ltd. | Mass flow controller |
| CN111113616A (en) * | 2019-12-30 | 2020-05-08 | 湖州练市皇盛木业有限公司 | Processing technology for heating floor board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2731287B2 (en) | 1998-03-25 |
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