JPH0482176A - Electric contact - Google Patents

Abstract

PURPOSE:To enlarge the surface area, enhance cooling effect due to ventilation and soldering strength, and prolong the service life, in the electric contacts parallel-arranged on a socket substrate or the like by forming at least one side of each electric contact to be fine irregular skin. CONSTITUTION:An electric contact 1 has the following function. Namely, by pushing a counter-contact 2 such as an IC lead onto an electric contact portion 1a, a contact 1d is displaced downwardly against its elasticity, and consequently the restoring elastic force is exerted on the counter-contact 2 thus generating a contact pressure. A plurality of the above electric contacts 1 are parallel- arranged, each being planted on two sides or four sides of a socket substrate 3 so as to make the male terminal portion pass therethrough. In each of the parallel-arranged electric contacts 1, the adjacent surface 1e is formed to be fine irregular skin 1e'.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electric contact which obtains contact force with a mating contact by the springiness of a contact piece.

BACKGROUND ART Conventionally, an electric contact has an electric contact part and a male terminal part provided on a contact piece having spring properties, and the contact force with the mating contact is obtained by the spring property of the contact piece. When the electrical contacts were arranged in parallel, the adjacent surfaces of each electrical contact had a smooth surface.

If the electrical component on the other side generates a high temperature as a result, or when the electrical contact is used at high temperatures, prepare a heat sink as a separate component and place the heat sink in close contact with the electrical component on the other side. The cooling effect of Am was improved.

Problems to be Solved by the Invention Since the electrical contact is configured as described above, when cooling the mating electrical components and the electrical contact by ventilation, the surface area of the electrical contact is small and the electrical contact is A sufficient cooling effect cannot be obtained with the solder alone, and a heat sink must be prepared as a separate component.Also, when soldering the male terminal to a printed circuit board, etc., the contact area between the male terminal and the solder may be too large. Small and weak solder strength. In addition, when the above-mentioned electrical contact is continuously punched from a strip of spring contact material, there are no areas where stress concentration occurs when the electrical contact is deformed against its spring properties. Since the punched surface is not smooth, there is a problem in that stress concentration increases and as a result, the life of the electrical contact is shortened.

Means for Solving the Problems As a means for solving the above-mentioned problems, the present invention has an electric contact portion and an M terminal portion provided on the contact piece having spring properties, and are arranged in parallel on a socket board or the like. In the electrical contacts that are arranged in parallel, at least one side of the adjacent surfaces of each electrical contact is provided with a finely uneven surface, and the surface area of the electrical contact is increased by the uneven surface, and the surface area of the electrical contact is increased. The cooling effect and soldering increase the strength, and furthermore, the stress when the electric contact is deformed against its springiness is dispersed by the uneven surface, so that the life of the electric contact is extended. It is something.

In addition, as an example, an uneven ground surface is formed by etching,
This is to obtain the desired uniform and finely uneven ground surface.

In yet another embodiment, electrical contacts are continuously punched out from a strip made of a spring contact material, at least one surface of which has been etched to form an uneven surface, thereby obtaining desired electrical contacts. be.

Operation In the present invention, an uneven surface is provided on the adjacent surface of each electrical contact.

That is, a group of innumerable fine protrusions are formed on the surface of the electric contact, and as a result, the surface area of the electric contact increases, the cooling effect due to ventilation, etc. increases, and the heat sink can be saved. becomes.

Furthermore, since the surface area of the terminal portion of the electric contact increases, the contact area between the terminal portion and the solder increases when soldering to a printed circuit board, etc., and the strength of the soldering increases.

Furthermore, in the case where the electrical contact is continuously punched out from a strip made of a spring contact material, the side surface is uneven in areas where stress concentration occurs when the electrical contact is deformed against its springiness. Since it is located on the ground, stress is dispersed over the uneven ground surface, and as a result, the maximum stress value is reduced and the life of the electrical contact can be extended.

EXAMPLE Hereinafter, an example of the present invention will be explained based on FIGS. 1 to 7.

As shown in FIG. 1, the electrical contact 1 has a springy contact piece 1d that extends above the horizontal connection piece 1c and can be elastically displaced up and down at one end of the horizontal connection piece 1c, and has a contact piece 1d at the other end. The contact piece 1d has a male terminal part 1b extending downward, and an upwardly directed protrusion is formed at the free end of the contact piece 1d, which serves as an electrical contact part 1a.

As shown in FIG. 1, the electrical contact 1 is constructed by pressing a mating contact 2 such as an IC lead against the electrical contact 1a, thereby displacing the contact piece 1d downward against its elasticity. The contact pressure with the mating contact 2 is obtained by the restoring elasticity.

Furthermore, as shown in FIGS. 5 and 6, the electric contact 1 has the following features:
A plurality of male terminals are planted and arranged in parallel so as to penetrate through two or four sides of the socket board 3, and correspond to the position of the mating contact 2, and each electric contact 1 is connected with or without an insulating gap M3a. Without a doubt, they were each other's concubines.

The present invention provides a spring contact type electrical contact 1 as described above, in which the adjacent surface 1e is the first when the electrical contacts 1 are arranged in parallel.
As shown in the figure, the ground surface has minute irregularities 1e.

2 and 3 show the side and back sides of the electrical contact 1,
FIG. 7 shows an enlarged cross section, especially FIG.
Since the uneven ground surface 1e is formed as shown in FIG. 7, the surface area of the electrical contact 1 increases.

The finely uneven surface 1e' may be formed after the electrical contact 1 is continuously punched out from a strip made of spring contact material, but it is preferable to form it as shown in FIGS. 4A to 4C. First, one or two surfaces of the strip plate 8 made of the spring contact material are sandblasted or etched with ferric chloride or cupric chloride to form an uneven surface IE, and then punched out continuously by pressing. good. It is desired that the above-mentioned uneven ground surface 1e' has convexity and concavity of rtl181 and is uniform in distribution and height. The above-mentioned sandblasting, especially etching, can provide a high-density and uniform uneven surface le', and by selecting the sandblasting particles, etching solution concentration, etching time, etc., the size of the unevenness and depression can be easily reduced. You can choose.

As described above, it is possible to obtain the electrical contact 1 in which the uneven surface 1e' is formed on one or both of the adjacent surfaces 1e, and a plurality of these are arranged in parallel on two or four sides of the socket board 3,
They are arranged so that they are adjacent to each other with the uneven ground surface 1e'. A mating contact 2 such as an IC lead of a flat IC is placed on the electrical contact portion 1a of the electric contact 1, and the contact portion is pressed by closing the λ cover 4 on the socket board 3. The contact piece 1d is displaced downward, and contact pressure is obtained by using its restoring force. The lock lever 5 holds the presser cover 4 closed and maintains the above-mentioned contact state.

When the contact pressure is obtained by the restoring force of the contact piece 1d as described above, the contact piece 1d repeatedly bends toward the punched surface using its base as a fulcrum each time the mating contact 2 is placed on the contact piece 1d. As a result, stress is generated in the contact piece 1d.

The maximum stress occurs at the location where the maximum bending moment occurs, and in this embodiment, the base of the contact piece becomes the maximum stress portion 1f. Stress tends to be concentrated in the part where the spring shape changes, and taking the spring shape in this example as an example, the surface of the maximum stress part 1f is a punched surface (fractured surface) that is not very smooth, so the stress The result was that the stress was concentrated at one point and the contact piece 1d was broken, but when the uneven ground surface 1e' is formed on the side surface of the maximum stress part 1f as in this embodiment, the stress is concentrated at one point. As a result, the contact piece 1d is dispersed into a large number of fine protrusions and depressions, and breakage of the contact piece 1d can be effectively prevented.

Furthermore, when a mating electrical component such as a flat IC heats up, the heat is transferred to the electrical contact 1, and then the heat is effectively dissipated from the surface of the electrical contact 1 whose area has been increased by the uneven ground surface 1e'. be done. Furthermore, since the male terminal portion 1b of the electrical contact 1 is also formed with an uneven surface le', when the male terminal portion 1b of the electrical contact 1 is soldered to the printed circuit board 6, etc., the solder 7 and The contact area with the male terminal portion 1b increases, and the printed circuit board 6 is soldered in such a way that the solder 7 bites into the uneven surface 1e' of the male terminal portion 1b as shown in FIG. etc. and the male terminal part 1b of the electrical contact 1
The strength of soldering increases.

9 in Figure 7 is the uneven ground te' (tlJR contact surface 1e)
and a plating layer covering the punched surface.

DETAILED DESCRIPTION OF THE INVENTION As described in detail, in the present invention, fine unevenness is provided on the adjacent surface of the electrical contacts when they are arranged in parallel on a socket board, etc., and the surface area of the electrical contacts is increased by the fine unevenness. The surface area of the electrical contact can be increased by increasing the surface area of the electrical contact to increase the cooling effect due to ventilation, and the soldering strength of the soldering can be increased by increasing the soldering surface area of the electrical contact due to the uneven surface. Furthermore, the stress when the electric contact is deformed against its springiness can be dispersed by the uneven ground surface, and the life of the electric contact can be extended.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electric contact showing an embodiment of the present invention;
Figure 2 is a side view of the same, Figure 3 is a rear view of the same, Figure 4A is a side view of a strip made of spring contact material with an uneven surface, and Figure 4B is a pressed strip. Side view of Figure 4C
is a side view of the electric contact punched out from the strip plate according to Figure 4, Figure 5 is a plan view of the socket in which the electric contact is implanted, and Figure 6 is the parallel arrangement of the electric contacts in the same socket. FIG. 7 is an enlarged sectional view illustrating the state of soldering of the electric contact. 1... Electric contact, 1a... Electric contact part, 1b...
・Male terminal part, 1d... Contact piece, 1e... Adjacent surface, 1e
'...Uneven ground surface, 1f...Maximum stress part, 2...Mating contact, 3...Socket board, 6...Printed board, 7...Solder. Figure ≠Figure A Figure 5

Claims (3)

[Claims] (1) In electrical contacts that have an electrical contact part and a male terminal part provided on a contact piece with spring properties and are arranged in parallel on a socket board, etc., the adjacent surface of each electrical contact when they are arranged in parallel. An electrical contact characterized in that at least one side of the electrical contact has a finely uneven surface. (2) The electrical contact according to claim 1, wherein the uneven surface is formed by etching. (3) The electric contact according to claim 1, characterized in that the electric contact is made of a spring contact material and is punched out of a strip plate whose at least one surface is made into an uneven surface by etching. .