JPH0481529B2 - - Google Patents
Info
- Publication number
- JPH0481529B2 JPH0481529B2 JP33141387A JP33141387A JPH0481529B2 JP H0481529 B2 JPH0481529 B2 JP H0481529B2 JP 33141387 A JP33141387 A JP 33141387A JP 33141387 A JP33141387 A JP 33141387A JP H0481529 B2 JPH0481529 B2 JP H0481529B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- mold body
- chamber
- mold
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/12—Cooling, heating, or insulating the plunger, the mould, or the glass-pressing machine; cooling or heating of the glass in the mould
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Extrusion Of Metal (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光学素子の素材である被成形物を加熱
軟化させて加圧成形し、しかる後、真空又は不活
性ガス雰囲気中で冷却して光学素子を得る光学素
子成形機に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention involves heat-softening and pressure-molding a molded object, which is a material for an optical element, and then cooling it in a vacuum or an inert gas atmosphere. The present invention relates to an optical element molding machine for producing optical elements.
例えば、特開昭61−44721号公報所載の通り、
加熱・加圧室に並べて冷却室を設け、冷却室内に
おいて加圧成形された被成形物を自然冷却する構
造のものがある。
For example, as described in Japanese Patent Application Laid-Open No. 61-44721,
There is a structure in which a cooling chamber is provided side by side with the heating/pressurizing chamber, and the molded object formed under pressure is naturally cooled in the cooling chamber.
また、被成形物を強制冷却するものとして特開
昭62−191128号公報所載のように金型体に冷却媒
体流通用の空洞を設けたものがある。 Furthermore, as a device for forcedly cooling a molded object, there is a device in which a mold body is provided with a cavity for the circulation of a cooling medium, as described in Japanese Patent Application Laid-Open No. 191128/1983.
〔発明が解決しようとする問題点〕
前記従来中、自然冷却するものは、被成形物の
成形時に金型体の温度が400℃〜700℃まで上昇
し、これを自然冷却することを考えると相当な時
間を要することは明らかで効率的な光学素子の成
形を行えない欠点がある。[Problems to be solved by the invention] In the above-mentioned conventional methods, the temperature of the mold body rises to 400°C to 700°C during molding of the molded object, and it is difficult to naturally cool it. It is clear that it takes a considerable amount of time, and it has the disadvantage that it is not possible to mold optical elements efficiently.
また、金型体に空洞を設けてこれに冷却媒体を
注入して冷却する構造のものは、冷却手段として
は注目すべき点はあつても、金型体に空洞を設け
ることによつて必然的に金型自体を大きくせざる
を得ず、冷却の前段階で加熱・加圧時に熱容量が
増して加熱時間が必然的に長くなるばかりでなな
く、水等の冷却媒体の残留によつて次段の加熱
(加圧)時に、該媒体の沸騰或いは金型体の加熱
温度が一定しないことが充分予測される。 In addition, although there are some noteworthy points as a cooling means for those with a structure in which a cavity is provided in the mold body and a cooling medium is injected into the cavity, there are some unavoidable problems due to the provision of a cavity in the mold body. Therefore, the mold itself has to be made larger, and the heat capacity increases during heating and pressurization in the pre-cooling stage, which inevitably lengthens the heating time. It is fully predicted that during the next stage of heating (pressurization), the boiling temperature of the medium or the heating temperature of the mold body will not be constant.
本発明は斯様な従来例の欠点を除去し、光学素
子の成形時間の短縮を意図して案出したものであ
る。 The present invention has been devised with the intention of eliminating the drawbacks of such conventional examples and shortening the molding time of optical elements.
金型体に納めた被成形物を加熱・加圧する成形
室の下側に、真空又は不活性ガス雰囲気中で前記
被成形物を冷却する冷却室を設け、該冷却室の受
支台又は受支台に載置する前記金型体の近傍に金
型体の冷却装置を設けて構成し、成形室と冷却室
との間の金型体の移動操作を簡略化させ、かつ、
金型体を大形にせずに冷却装置によつて金型体の
冷却を促進させるようにしたのである。
A cooling chamber for cooling the molded material in a vacuum or inert gas atmosphere is provided below the molding chamber where the molded material placed in the mold body is heated and pressurized. A cooling device for the mold body is provided in the vicinity of the mold body placed on the abutment, thereby simplifying the operation of moving the mold body between the molding chamber and the cooling chamber, and
The cooling of the mold body was promoted by a cooling device without making the mold body large.
図面は本発明に係る光学素子の成形機の実施例
を示し、図示1は支柱2上に載置した基台、3は
基台1上に載置した枠体4で取り囲んだ冷却室を
それぞれ示し、冷却室3内には前記基台1に立設
した支柱2′で支持された成形室5を設け、成形
室5は断熱材6で取り囲んで前記冷却室3と区画
してある。成形室5の上部には受圧ブロツク7を
下方に向けて突設し、この受圧ブロツク7の軸線
に沿う直下に保持筒8を設け、該保持筒8の内側
には断熱材9で取り囲んだヒーター10を前記軸
線に沿つて縦設してある。
The drawings show an embodiment of the optical element molding machine according to the present invention, in which 1 shows a base placed on a support 2, and 3 shows a cooling chamber surrounded by a frame 4 placed on the base 1. In the cooling chamber 3, there is provided a molding chamber 5 supported by struts 2' erected on the base 1, and the molding chamber 5 is surrounded by a heat insulating material 6 and separated from the cooling chamber 3. A pressure receiving block 7 is provided in the upper part of the molding chamber 5 to protrude downward, a holding cylinder 8 is provided directly below the pressure receiving block 7 along the axis, and a heater surrounded by a heat insulating material 9 is provided inside the holding cylinder 8. 10 are vertically arranged along the axis.
11は成形室5と冷却室3との連通孔で、連通
孔11は前記受圧ブロツク7の直下にして、しか
も、成形室5を構成する底板6′に設けたもので
ある。 Reference numeral 11 denotes a communication hole between the molding chamber 5 and the cooling chamber 3, and the communication hole 11 is provided directly below the pressure receiving block 7 and in the bottom plate 6' constituting the molding chamber 5.
12はこの連通孔11を通じて冷却室3と成形
室5を出入する金型体12はシリンダー軸13上
に載置した受支板14上に着脱自在に載置され、
本体筒15と被成形物aを挟持する上下一対の金
型16,17とで構成したものである。 The mold body 12, which enters and exits the cooling chamber 3 and the molding chamber 5 through the communication hole 11, is removably placed on a support plate 14 placed on the cylinder shaft 13.
It is composed of a main body cylinder 15 and a pair of upper and lower molds 16 and 17 that sandwich a molded object a.
前記のシリンダー軸は基台11に設けた受支台
18を通じて冷却室3り導出してシリンダー19
に連携させてある。 The cylinder shaft is led out to the cooling chamber 3 through a support pedestal 18 provided on the base 11 and connected to the cylinder 19.
It is linked to.
図示20,20′は上金型16又は下金型17
の温度を測定する熱電対、21は断熱リング、2
2は真空ポンプに連通させる接続管、23は不活
性ガスボンベに連通させる接続管で、各接続管2
2,23は前記基台1に設けて冷却室3と外界と
を連通させるものである。 20 and 20' shown in the figure are the upper mold 16 or the lower mold 17.
21 is a heat insulating ring, 2 is a thermocouple that measures the temperature of
2 is a connecting pipe that communicates with the vacuum pump, 23 is a connecting pipe that communicates with an inert gas cylinder, and each connecting pipe 2
2 and 23 are provided on the base 1 to communicate the cooling chamber 3 with the outside world.
また、図示24は冷却室3の開閉扉である。 Further, the illustrated reference numeral 24 is an opening/closing door of the cooling chamber 3.
なお、図示30,30′は熱電対20,20′の
係合空隙、31は金型体12の組立台を示す。 Note that 30 and 30' shown in the figure are engagement gaps for the thermocouples 20 and 20', and 31 is an assembly stand for the mold body 12.
しかして、被成形物aを組付けた金型12を受
支板14に載置して、接続管22,23を利用し
て各室3,5内の空気を不活性ガスに置換しつ
つ、ヒーター10に通電気してヒーター10を加
熱し、シリンダー19を作動させて前記金型体1
2を連通孔11を通じて成形室5内のヒーター部
10に挿入して所定の温度まで加熱し、しかる
後、シリンダー19をさらに作動させて金型体1
2を押し上げると、金型体12の上下金型16,
17は受圧ブロツク7と受支板14によつて挟圧
され、この挟圧によつて上下金型16,17間に
介在させた被成形物aは所定形状に変形され、上
型16および下型17の型面に沿つた変形時点
で、ヒーター10の温度を徐々に降下せしめ、被
成形物aの流動が止まり、所定形状に固定化され
た時点で、再び、シリンダー19を動作させて金
型12を冷却室3に備えた受支台18上に載置し
て冷却するのである。 Then, the mold 12 with the object to be formed a assembled thereon is placed on the support plate 14, and the air in each chamber 3, 5 is replaced with inert gas using the connecting pipes 22, 23. , the heater 10 is energized to heat the heater 10, and the cylinder 19 is operated to heat the mold body 1.
2 is inserted into the heater part 10 in the molding chamber 5 through the communication hole 11 and heated to a predetermined temperature, and then the cylinder 19 is further operated to heat the mold body 1.
2, the upper and lower molds 16 of the mold body 12,
17 is pinched by the pressure receiving block 7 and the supporting plate 14, and due to this pinching, the molded object a interposed between the upper and lower molds 16 and 17 is deformed into a predetermined shape, and the upper mold 16 and the lower mold 17 are When the mold 17 is deformed along the mold surface, the temperature of the heater 10 is gradually lowered, and when the molded material a stops flowing and is fixed in a predetermined shape, the cylinder 19 is operated again to deform the mold. The mold 12 is placed on a support stand 18 provided in the cooling chamber 3 and cooled.
(第1実施例)
第1実施例は第1図で示している。この第1実
施例のものは、受支台18の内部に冷却水路25
を設け、該冷却水路25の両端25′,25′を冷
却機に接続して構成したものである。(First Example) A first example is shown in FIG. In this first embodiment, a cooling water channel 25 is provided inside the support stand 18.
, and both ends 25', 25' of the cooling water channel 25 are connected to a cooler.
すなわち、加熱・加圧成形機、受支台18上に
載置された金型体12は、受支台18の冷却水路
25を流れる冷却水によつて被成形物aの材質が
酸化されない温度まで急速に冷却され、冷却完了
後、開閉扉24を通じて外部に取り出すようにし
てある。 That is, the heating/pressure molding machine and the mold body 12 placed on the support stand 18 are heated at a temperature at which the material of the molded object a is not oxidized by the cooling water flowing through the cooling water channel 25 of the support stand 18. After cooling is completed, it is taken out to the outside through an opening/closing door 24.
(第2実施例)
第2図は第2実施例を示している。この実施例
のものは、受支台18にヒートパイプ26を装着
し、該ヒートパイプ26を受支台18より導出し
た片端に放熱フイン27を取り付けて構成したも
のである。(Second Embodiment) FIG. 2 shows a second embodiment. In this embodiment, a heat pipe 26 is attached to a support base 18, and a heat radiation fin 27 is attached to one end of the heat pipe 26 led out from the support base 18.
この実施例のものは、高温状態の金型体12が
受支台18に載置して接触することにより、金型
体12の熱が受支台18に伝わり、受支台18に
伝わつた熱はヒートパイプ26を経てフイン27
によつて放熱される。 In this embodiment, when the mold body 12 in a high temperature state is placed on and in contact with the pedestal 18, the heat of the mold body 12 is transmitted to the pedestal 18, and then to the pedestal 18. Heat passes through the heat pipe 26 to the fin 27
Heat is radiated by
この第2実施例によれば、冷却水等の媒体を用
いることなく効率的な放熱を行うことができる。 According to this second embodiment, efficient heat radiation can be performed without using a medium such as cooling water.
(第3実施例)
第3図で示す第3実施例のものは、受支台18
上に載置される金型体12の近傍に噴射ノズル2
8を設け、該ノズル28をボンベ29に接続して
構成したもので、加熱・加圧成形後、受支台18
上に載置された金型体12は、ノズル28から噴
出する冷却媒体によつて冷却され、金型体12は
媒体によつて直接冷却されるから高効率な冷却作
業が行えるのである。(Third Embodiment) In the third embodiment shown in FIG.
An injection nozzle 2 is installed near the mold body 12 placed on top.
8, and the nozzle 28 is connected to the cylinder 29. After heating and pressure molding, the support stand 18
The mold body 12 placed thereon is cooled by the cooling medium jetted from the nozzle 28, and since the mold body 12 is directly cooled by the medium, a highly efficient cooling operation can be performed.
(他実施例)
第1実施例は冷却水を用いるようにしている
が、冷却空気であつても良い。(Other Examples) Although the first example uses cooling water, cooling air may also be used.
本発明は成形室の下側に冷却室を設けたもので
あるから、金型体の両室間の移動を被成形物加圧
用のシリンダーを用いることによつて簡単に行う
ことができる。すなわち、従来例のごとき、特別
な搬送装置を必要としない。
In the present invention, since the cooling chamber is provided below the molding chamber, the mold body can be easily moved between the two chambers by using a cylinder for pressurizing the molded object. That is, unlike the conventional example, a special conveyance device is not required.
また、冷却室には金型体を載置する受支台を設
けて金型体の冷却装置を配設してあるから、金型
体即ち被成形物を急速に冷却させることができる
ので被成形物の成形作業を能率的に行なえる。 In addition, since the cooling chamber is provided with a supporting stand on which the mold body is placed and a cooling device for the mold body is installed, the mold body, that is, the object to be molded, can be rapidly cooled. Molding work for molded products can be carried out efficiently.
図面は本発明に係る光学素子成形機の実施例を
示し、第1図は第1実施例、第2図は第2実施
例、第3図は第3実施例をそれぞれ示す断面図で
ある。また、第4図aないしcは金型体の各実施
形を示す断面図である。
3…冷却室、5…成形室、12…金型体、18
…受支台、25…冷却水路、27…放熱フイン、
28…噴射ノズル。
The drawings show embodiments of the optical element molding machine according to the present invention, and FIG. 1 is a cross-sectional view showing the first embodiment, FIG. 2 is a second embodiment, and FIG. 3 is a sectional view of a third embodiment. Moreover, FIGS. 4a to 4c are sectional views showing each embodiment of the mold body. 3... Cooling chamber, 5... Molding chamber, 12... Mold body, 18
...Support stand, 25...Cooling channel, 27...Radiation fin,
28...Injection nozzle.
Claims (1)
形室の下側に、真空又は不活性ガス雰囲気中で前
記被成形物を冷却する冷却室を設け、該冷却室に
は受支台に載置する前記金型体の冷却装置を設け
た光学素子の成形機。1. A cooling chamber for cooling the molded product in a vacuum or inert gas atmosphere is provided below the molding chamber where the molded product placed in the mold body is heated and pressurized. A molding machine for optical elements, which is provided with a cooling device for the mold body placed on the mold body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33141387A JPH01172230A (en) | 1987-12-25 | 1987-12-25 | Formation device for optical element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33141387A JPH01172230A (en) | 1987-12-25 | 1987-12-25 | Formation device for optical element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01172230A JPH01172230A (en) | 1989-07-07 |
JPH0481529B2 true JPH0481529B2 (en) | 1992-12-24 |
Family
ID=18243402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33141387A Granted JPH01172230A (en) | 1987-12-25 | 1987-12-25 | Formation device for optical element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01172230A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4489507B2 (en) * | 2004-06-16 | 2010-06-23 | 東芝機械株式会社 | Glass forming equipment |
-
1987
- 1987-12-25 JP JP33141387A patent/JPH01172230A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01172230A (en) | 1989-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |