JPH0480063U - - Google Patents
Info
- Publication number
- JPH0480063U JPH0480063U JP1990124420U JP12442090U JPH0480063U JP H0480063 U JPH0480063 U JP H0480063U JP 1990124420 U JP1990124420 U JP 1990124420U JP 12442090 U JP12442090 U JP 12442090U JP H0480063 U JPH0480063 U JP H0480063U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- lower electrode
- semiconductor device
- hole
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990124420U JPH0480063U (US06229276-20010508-P00022.png) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990124420U JPH0480063U (US06229276-20010508-P00022.png) | 1990-11-26 | 1990-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0480063U true JPH0480063U (US06229276-20010508-P00022.png) | 1992-07-13 |
Family
ID=31872072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990124420U Pending JPH0480063U (US06229276-20010508-P00022.png) | 1990-11-26 | 1990-11-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0480063U (US06229276-20010508-P00022.png) |
-
1990
- 1990-11-26 JP JP1990124420U patent/JPH0480063U/ja active Pending