JPH0479437U - - Google Patents
Info
- Publication number
- JPH0479437U JPH0479437U JP12413090U JP12413090U JPH0479437U JP H0479437 U JPH0479437 U JP H0479437U JP 12413090 U JP12413090 U JP 12413090U JP 12413090 U JP12413090 U JP 12413090U JP H0479437 U JPH0479437 U JP H0479437U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- correspondence
- integrated circuit
- type semiconductor
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12413090U JPH0479437U (uk) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12413090U JPH0479437U (uk) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479437U true JPH0479437U (uk) | 1992-07-10 |
Family
ID=31871798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12413090U Pending JPH0479437U (uk) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479437U (uk) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022038870A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社東芝 | 半導体パッケージ及びマーキング方法 |
-
1990
- 1990-11-26 JP JP12413090U patent/JPH0479437U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022038870A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社東芝 | 半導体パッケージ及びマーキング方法 |