JPH047887Y2 - - Google Patents

Info

Publication number
JPH047887Y2
JPH047887Y2 JP1987052929U JP5292987U JPH047887Y2 JP H047887 Y2 JPH047887 Y2 JP H047887Y2 JP 1987052929 U JP1987052929 U JP 1987052929U JP 5292987 U JP5292987 U JP 5292987U JP H047887 Y2 JPH047887 Y2 JP H047887Y2
Authority
JP
Japan
Prior art keywords
polishing
polishing plate
specimen
tank
support frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987052929U
Other languages
Japanese (ja)
Other versions
JPS63158751U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987052929U priority Critical patent/JPH047887Y2/ja
Publication of JPS63158751U publication Critical patent/JPS63158751U/ja
Application granted granted Critical
Publication of JPH047887Y2 publication Critical patent/JPH047887Y2/ja
Expired legal-status Critical Current

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  • Sampling And Sample Adjustment (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案はコンクリートその他固形建築材料から
サンプリングした供試体の端面研磨装置に関す
る。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an end face polishing device for specimens sampled from concrete and other solid building materials.

〈従来の技術〉 従来供試体の端面研磨装置には、実開昭60−
165841号並びに実開昭60−165842号があつた。
<Conventional technology> Conventional end face polishing equipment for specimens was developed in 1980.
No. 165841 and Utility Model No. 165842 were issued.

〈考案が解決しようとする問題点〉 しかし、上記従来例においては取扱操作が単純
な割りに構成が複雑なこと及び小型化が困難であ
るなどの欠点があつた。
<Problems to be Solved by the Invention> However, the above-mentioned conventional example has drawbacks such as a complex structure despite its simple handling and difficulty in miniaturization.

本考案は拘る欠点に改善を加えた研磨機を提供
するものである。
The present invention provides a polishing machine that improves the above drawbacks.

〈問題点を解決する為の手段〉 下部機枠上面に立設した支柱上に、電動機にて
回動せしめられる研磨板を下端に取り付けた回転
軸を有する研磨板支持枠を水平に揺動自由に枢設
し、前記下部機枠上面に、該支持枠下面の研磨板
と相対する位置に研磨面を対向せしめて供試体を
不動に保持すると共に、該研磨板を供試体の研磨
量に応じて移動せしめるための送り機構を下部機
枠に設け、研磨面に注水しながら研磨するように
してなる。
<Means for solving the problem> A polishing plate support frame having a rotating shaft with a polishing plate rotated by an electric motor attached to the lower end on a column erected on the upper surface of the lower machine frame can be freely swung horizontally. The polishing surface is mounted on the upper surface of the lower machine frame at a position opposite to the polishing plate on the lower surface of the support frame to hold the specimen immovably, and the polishing plate is rotated according to the amount of polishing of the specimen. A feeding mechanism for moving the polishing surface is provided in the lower machine frame, and polishing is performed while pouring water onto the polishing surface.

〈作用〉 下部機枠上面の所定位置に供試体を不動に装着
し、研磨板と供試体とのなす研磨面に注水しなが
ら、研磨板支持枠上に設けた電動機を駆動して該
研磨板を回動させながら、該支持枠を手動にて水
平方向に反復揺動させて、研磨板に送りをかけて
供試体の端面を研磨する。
<Function> The specimen is mounted immovably at a predetermined position on the upper surface of the lower machine frame, and while pouring water onto the polishing surface formed by the polishing plate and the specimen, the electric motor provided on the polishing plate support frame is driven to remove the polishing plate. While rotating the support frame, the support frame is manually repeatedly oscillated in the horizontal direction, and the polishing plate is fed to polish the end surface of the specimen.

〈実施例〉 以下、本考案について図面に示す実施例により
詳細に説明すると、下部機枠1の上面に立設した
支柱18の上部に研磨板支持枠13を水平に揺動
自由に枢支し、且つ該下部機枠1の前面に設けた
操作盤4上のハンドル5の操作によつて上下動可
能にし、該支持枠13の片寄り位置に、下端に研
磨板12を定着した回転軸14を垂直軸受15に
より回動自由に枢支し、該回転軸14と研磨板支
持枠13内に設置した電動機16の出力軸とをベ
ルト17により連結して、該研磨板12を該電動
機16により回動せしめると共に、前記研磨板支
持枠13を、該支持枠13の前面に突設した揺動
把手19により揺動するようにしている。
<Embodiment> Hereinafter, the present invention will be described in detail with reference to an embodiment shown in the drawings.A polishing plate support frame 13 is horizontally pivotably supported on the upper part of a column 18 erected on the upper surface of the lower machine frame 1. , and a rotary shaft 14 which can be moved up and down by operating a handle 5 on an operation panel 4 provided on the front surface of the lower machine frame 1, and has a polishing plate 12 fixed at its lower end at a position offset from the support frame 13. is rotatably supported by a vertical bearing 15, and the rotating shaft 14 and the output shaft of an electric motor 16 installed in the polishing plate support frame 13 are connected by a belt 17, and the polishing plate 12 is rotated by the electric motor 16. At the same time, the polishing plate support frame 13 is swung by a swing handle 19 protruding from the front surface of the support frame 13.

そして研磨板支持枠13の下面と、前記下部機
枠1の上面板7との対向空間を研磨加工部とし、
クランプ11により供試体10を掴持するように
すると共にその周囲を開閉自由な二つ割りカバー
8,8により掩つて研磨作業時に発生する飛沫を
防止するようにしている。
and a space where the lower surface of the polishing plate support frame 13 faces the upper surface plate 7 of the lower machine frame 1 is used as a polishing processing section;
The specimen 10 is gripped by the clamp 11, and its surroundings are covered by two-split covers 8, 8 which can be opened and closed to prevent splashes generated during polishing work.

又、前記供試体10と研磨板12との接触研削
部と下部機枠1内に設置したタンク3との間をポ
ンプ2を介して配管すると同時に、前記供試体1
0の下側に対置した水受皿22と前記タンク3と
の間を集水管21にて接続するように構成してい
る。尚、図面中符号9は供試体10と研磨板12
との対向間〓を予め調整するための高さ調整板で
ある。
Further, at the same time, piping is connected between the contact grinding part of the specimen 10 and the polishing plate 12 and the tank 3 installed in the lower machine frame 1 via the pump 2.
A water collecting pipe 21 connects a water receiving tray 22 placed oppositely to the lower side of the tank 3 to the tank 3. In addition, the reference numeral 9 in the drawings indicates the specimen 10 and the polishing plate 12.
This is a height adjustment plate for adjusting in advance the distance between the two.

次に上記構成の一連動作について述べると、先
ずタンク3内には予め所定量の水を入れておき、
次にカバー8,8の合わせ部を解いて、その中央
部所定位置にコンクリートその他岩石などの供試
体を起立状態でクランプ11により不動に保持
し、再びカバー8,8を閉合する。
Next, to describe a series of operations of the above configuration, first, a predetermined amount of water is poured into the tank 3,
Next, the mating portions of the covers 8, 8 are released, a specimen such as concrete or rock is immovably held in an upright position at a predetermined position in the center by the clamp 11, and the covers 8, 8 are closed again.

そして前記揺動把手19を充分に握持した状態
(安定の為に)で操作盤4上の起動スイツチ6を
押動することにより、電動機16が駆動し、ベル
ト17を介して回転軸14を定速回転せしめる。
この状態では研磨板12と供試体10との非接触
状態であるので研磨を開始するには、操作盤4上
のハンドル5を回動操作して研磨板12を供試体
10の面に向かつて徐々に下降接近させることに
より、やがて両者は接触して研磨状態となる。
Then, by pressing the start switch 6 on the operation panel 4 while fully grasping the swing handle 19 (for stability), the electric motor 16 is driven and the rotating shaft 14 is driven through the belt 17. Rotate at a constant speed.
In this state, there is no contact between the polishing plate 12 and the specimen 10, so to start polishing, rotate the handle 5 on the operation panel 4 to direct the polishing plate 12 toward the surface of the specimen 10. By gradually lowering and approaching each other, the two eventually come into contact and become polished.

そこで前記ハンドル5の操作で研磨板12に送
りをかけながら把手19を支柱18を中心にして
水平面上を揺動させることにより供試体10の端
面は平滑に研磨され、その間研磨面にはポンプ2
の動作によつて常にタンク5から送水管20を経
て水が注水され、研磨微粉の飛散を防止しなが
ら、受皿22にて受けられた水は再び集水管21
を経てタンク3内に帰還するように動作する。
Therefore, by operating the handle 5 to feed the polishing plate 12 and swinging the handle 19 on a horizontal plane about the support 18, the end face of the specimen 10 is polished smoothly.
As a result of this operation, water is always injected from the tank 5 through the water pipe 20, and while preventing the scattering of the abrasive powder, the water received in the saucer 22 is returned to the water collection pipe 21.
It operates so that it returns to the tank 3 through the process.

〈考案の効果〉 本考案は、上述のように構成され、供試体を直
立状態で装着保持するようにしたので構成が簡単
であり、設置面積を極力小さくすることが可能で
ある。
<Effects of the Invention> The present invention is constructed as described above, and the specimen is mounted and held in an upright state, so the construction is simple and the installation area can be minimized.

又、研磨板の揺動動作が水平面上の動きである
為に腕の疲れが少ないなどの効果を有する。
Furthermore, since the swinging motion of the polishing plate is a movement on a horizontal plane, it has the effect of reducing arm fatigue.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案研磨装置の正面図、第2図
は、同上右側面図である。 1……下部機枠、8……カバー、10……供試
体、11……クランプ、12……研磨板、13…
…研磨板支持枠、14……回転軸、16……電動
機、18……支柱、19……把手。
FIG. 1 is a front view of the polishing apparatus of the present invention, and FIG. 2 is a right side view of the same. 1... lower machine frame, 8... cover, 10... specimen, 11... clamp, 12... polishing plate, 13...
... Polishing plate support frame, 14 ... Rotating shaft, 16 ... Electric motor, 18 ... Support column, 19 ... Handle.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ポンプ2及びタンク3を収納設置した下部機枠
1上面に支柱18を立設し、該支柱18上に内部
に設置した電動機16にて駆動せしめられ且つ上
下に移動可能な研磨板12を有する研磨板支持枠
13を揺動自在に枢支し、前記下部機枠1上面と
該研磨板支持枠13下面との間に、研磨板12と
対向する供試体を保持するクランプ11を設ける
と共に、その周囲を掩う開閉自在な二つ割りカバ
ー8,8を設け、該供試体の研磨板12と接する
位置と前記タンク3との間にポンプ2と連通した
送水管20を配設すると共に、供試体下部の水受
皿22とタンク3との間に集水管21を配設して
成る供試体の端面研磨装置。
A polishing machine has a support 18 erected on the upper surface of the lower machine frame 1 housing the pump 2 and tank 3, and has a polishing plate 12 which is driven by an electric motor 16 installed inside the support and is movable up and down. A plate support frame 13 is swingably supported, and a clamp 11 is provided between the upper surface of the lower machine frame 1 and the lower surface of the polishing plate support frame 13 to hold a specimen facing the polishing plate 12. Two split covers 8, 8 that can be opened and closed to cover the surrounding area are provided, and a water pipe 20 that communicates with the pump 2 is installed between the tank 3 and the position in contact with the polishing plate 12 of the specimen. An end face polishing device for a specimen, comprising a water collecting pipe 21 disposed between a water receiving tray 22 and a tank 3.
JP1987052929U 1987-04-08 1987-04-08 Expired JPH047887Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987052929U JPH047887Y2 (en) 1987-04-08 1987-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987052929U JPH047887Y2 (en) 1987-04-08 1987-04-08

Publications (2)

Publication Number Publication Date
JPS63158751U JPS63158751U (en) 1988-10-18
JPH047887Y2 true JPH047887Y2 (en) 1992-02-28

Family

ID=30878529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987052929U Expired JPH047887Y2 (en) 1987-04-08 1987-04-08

Country Status (1)

Country Link
JP (1) JPH047887Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102398197B (en) * 2010-09-14 2013-09-18 交通运输部公路科学研究所 Flat plate polishing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526634B2 (en) * 1971-12-27 1980-07-15

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526634U (en) * 1978-08-07 1980-02-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526634B2 (en) * 1971-12-27 1980-07-15

Also Published As

Publication number Publication date
JPS63158751U (en) 1988-10-18

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