JPH0478766U - - Google Patents
Info
- Publication number
- JPH0478766U JPH0478766U JP12025490U JP12025490U JPH0478766U JP H0478766 U JPH0478766 U JP H0478766U JP 12025490 U JP12025490 U JP 12025490U JP 12025490 U JP12025490 U JP 12025490U JP H0478766 U JPH0478766 U JP H0478766U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- interlayer connection
- insulating substrate
- laminated busbar
- busbar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011229 interlayer Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12025490U JPH0478766U (hu) | 1990-11-19 | 1990-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12025490U JPH0478766U (hu) | 1990-11-19 | 1990-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0478766U true JPH0478766U (hu) | 1992-07-09 |
Family
ID=31868168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12025490U Pending JPH0478766U (hu) | 1990-11-19 | 1990-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0478766U (hu) |
-
1990
- 1990-11-19 JP JP12025490U patent/JPH0478766U/ja active Pending