JPH0478139A - Method for controlling temperature of radiation type substrate heating device - Google Patents

Abstract

PURPOSE:To cool a substrate at a high speed by arranging two transparent partition plates between a heat source and the substrate and making water to flow between the two partition plates when the substrate is heated and maintained at a fixed temperature and colored water or another medium when the substrate is cooled. CONSTITUTION:The inside of the external wall 6 of a container is divided into a lamp chamber 18 and sample chamber 19 by means of transparent partition plates 2 and 3 of quartz and a halogen lamp l which is set in the chamber 18 as a heat source. A silicon substrate 4 is put in the chamber 19 so that the substrate 4 can face the lamp l on opposite sides of the plates 2 and 3 and cooling pipes 7 are put around the external wall 6 of the container. The space between the two plates 2 and 3 is used as a flowing route of cooling water and one end of the space is connected to a cooling water supplying system 20. At the time of heating the substrate 4, cooling water is made to flow to the space by opening valves 8 and 16 and the halogen lamp l is turned on. At the time of cooling the substrate 4, valves 9 and 17 and a coloring valve 10 are opened after the lamp l is turned off and the valves 8 and 16 are closed. Therefore, a coloring agent is made to flow to the space between the partition plates 2 and 3 from a nozzle 11 through a pipe 22 and absorbs the heat.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention can be suitably used in a radiant substrate heating device that heats a substrate to be heat-treated using radiant heat from a heat source, and more specifically, in a heat treatment step in a VLSI manufacturing process. The present invention relates to a temperature control method for a radiant substrate heating device.

(Conventional technology) There is a 1m technology during the manufacturing process of integrated circuits.

In order to improve the reliability of this film formation control, a radiation substrate heating method is currently generally used as a method for heating the substrate.

The radiation type substrate heating method stops the radiation of the heat source itself when the temperature drops, and in normal pressure equipment, cools the substrate directly by flowing a medium with good heat conduction such as He, and in the case of reduced pressure equipment, it cools the substrate naturally. It is used for cooling.

(Problem to be Solved by the Invention) However, in conventional devices, even if the radiation of the heat source is stopped for cooling, there is a limit to the rate at which the substrate temperature can decrease because of the radiation due to the residual heat of the heat source itself and the surroundings of the heat source. Ta.

SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature control method in a radiation type substrate heating apparatus that can cool a substrate at high speed by controlling the amount of radiation from a heat source and a heat storage section around the heat source.

(Means for Solving the Problems) In order to achieve the above object, a temperature control method for a radiant substrate heating device according to the present invention is a radiant substrate heating method in which a heat source and a substrate are opposed to each other and the substrate is heated by the radiant heat of the heat source. In the temperature control method for an apparatus, two transparent partition plates are arranged between the heat source and the substrate, and when the temperature of the substrate is raised and maintained at a constant temperature, water is flowed between the transparent partition plates, and when the temperature of the substrate is lowered. , configured to flow colored water or other medium between the transparent partition plates.

(Function) According to this configuration, the substrate is heated by radiation from the heat source, but when the temperature rises, ordinary transparent cooling water is flowed between the partition plates to reduce the loss of radiant energy, and when the temperature falls, the substrate is heated by radiation from the heat source. turns off the power to the heater and flows colored cooling water to increase the absorption efficiency of heat radiation by the heat source and the heat capacity of the area around the heat source.
The amount of heat radiation to the substrate can be reduced and the rate of temperature drop can be increased.

(Example) Hereinafter, the present invention will be explained in more detail with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of a reduced pressure lamp type substrate heating apparatus to which the temperature control method according to the present invention is applied. It is an AA sectional view of a).

The outer wall 6 of the container in this embodiment has a cylindrical shape, and the interior is divided into a lamp chamber 18 and a sample chamber 19 by transparent partition plates 2 and 3 made of quartz.
It is divided into

A halogen lamp 1 serving as a heat source is arranged in a lamp chamber 11.

The halogen lamp 1 is energized and controlled by a power source 14 .

A silicon substrate 4 to be heated is placed in the sample chamber 19 . Silicon substrate 4 is supported by quartz susceptor 5. The sample chamber 19 is evacuated using an exhaust device (not shown).

The halogen lamp 1 and the silicon substrate 4 are in a positional relationship facing each other with transparent partition plates 2 and 3 of quartz interposed therebetween.

A cooling vibrator 7 is installed on the outer wall 6 of the container, and cooling water is supplied to the cooling pipe 7 from a cooling water circulation system (not shown).

This cooling pipe 7 is for preventing the temperature of the container from rising.

O-rings 13a and 13b are inserted between the container outer wall 6a and the quartz transparent partition plate 2 and between the container outer wall 6b and the quartz transparent partition plate 3, respectively, so that the lamp chamber 18 and the sample chamber 19 are completely isolated from the atmosphere. is blocked by.

A cooling water flow path is formed between the quartz transparent partition plates 2 and 3, one end of which is connected to a cooling water supply system 20, and the other end connected to a drainage system (not shown).

The cooling water supply system 20 is composed of two systems.

In one system, the cooling water 23 is connected to the valve 16. This route is connected to the flow path between the transparent quartz partition plates 2 and 3 via the vibrator 21 and the valve 8.

In the other system, the cooling water 23 is connected to the valve 17. This route is connected to the flow path between the quartz transparent partition plates 2.3 via the vibrator 22 and the valve 9.

The nozzle 11 of the vibrator 24 connected to the tank 15 is inserted into the middle part of the vibrator 22 along this route.

Tank 15 is filled with colorant, and valve 10
Cooling water can be colored by opening it.

Selection of each system can be made by opening and closing valves 8.9.16 and 17.

The radiant heat of the halogen lamp l passes through the quartz transparent partition plate 2.3 and the cooling water flowing between them and reaches the silicon substrate 4.

When heating the substrate, the valves 8 and 16 are opened to allow cooling water to flow, and the halogen lamp 1 is turned on.

The loss of thermal energy due to transmission through the transparent quartz plates 2 and 3 and the cooling water is extremely small, and the substrate is rapidly heated.

When lowering the substrate temperature, the halogen lamp 1 is turned off. However, heat radiation from the halogen lamp l and the heat storage section around it still continues.

Then valves 8 and 16 are closed and valves 9 and 17 are closed.
, and then open the coloring valve 1o.

As a result, the coloring agent flows from the nozzle 11 into the vibrator 22, and the colored cooling water flows through the channel between the quartz transparent partition plates 2.3 and absorbs the heat radiated from the lamp chamber 18 to the sample chamber 19, so that the sample can be sampled. Heat radiation to the chamber 19 can be prevented.

FIG. 2 is a graph showing the relationship between substrate temperature and time when heating and cooling are performed using the apparatus shown in FIG.

The substrate temperature was raised to 1050''C, held at that temperature for 3 minutes, and then lowered.

When the temperature was raised and when the temperature was maintained constant, the cooling water flowed without coloring.

When the temperature was lowered, the halogen lamp 1 was turned off and a coloring agent was added to the cooling water. The colorant is ink.

A silicon substrate with a resistivity of 0.001Ω1 or less was used as the substrate, and the substrate temperature was measured by embedding a W/Re thermocouple in the silicon substrate.

Curve 31 shows the case where transparent cooling water is flowed during both the five temperature rises, and the curve 32 shows the case where transparent cooling water is used when the temperature is rising and the cooling water is colored when the temperature is falling.

Comparing the two, it is found that the time required for the silicon substrate temperature to stabilize after the temperature rise and fall is the same in both cases, but there is a clear difference when the temperature falls.

It is clear that when colored cooling water is used, the temperature decrease rate becomes faster.

This can be considered to be due to the fact that the inflow of heat from the M heat section of the 18 lamp chambers was sufficiently blocked, resulting in an increase in the cooling efficiency of the substrate.

Although the embodiments of the reduced pressure type substrate heating apparatus have been described above, other types of radiation type substrate heating apparatuses, such as normal pressure type substrate heating apparatuses, can also be used and similar effects can be obtained.

(Effects of the Invention) As explained above, if the temperature control method according to the present invention is applied to a radiation-type substrate heating device, the amount of heat radiation to the substrate during temperature reduction can be significantly reduced, so the temperature reduction rate of the substrate can be reduced. It has the effect of being able to improve the

[Brief explanation of drawings]

Fig. 1(a) is a schematic sectional view showing an embodiment of a reduced pressure lamp type substrate heating apparatus to which the temperature control method according to the present invention is applied, and Fig. 1(a) is a sectional view taken along line A-A in Fig. 1(a). be. FIG. 2 is a graph showing the relationship between substrate temperature and time when colored water and non-colored water are flowed during cooling. 1...Halogen lamp 2.3...Quartz transparent partition plate 4...Silicon substrate 5...Quartz susceptor 6...Container outer wall 7...Cooling pipe 8.9.10,16. 17...Valve 11...Nozzle 12...Cooling water 13...0 ring 14...Power supply patent applicant Nichiden Anelva Co., Ltd. Agent Patent attorney Hisashi Inoro

Claims (1)

[Claims] In a temperature control method for a radiant substrate heating device, in which a heat source and a substrate are opposed to each other and the substrate is heated by radiant heat from the heat source, two transparent partition plates are disposed between the heat source and the substrate, and the substrate is heated. A radiant substrate heating device characterized in that water is flowed between the transparent partition plates when the temperature is maintained at a constant temperature, and colored water or other medium is flowed between the transparent partition plates when the temperature of the substrate is lowered. Temperature control method.