JPH0477241U - - Google Patents

Info

Publication number
JPH0477241U
JPH0477241U JP12134090U JP12134090U JPH0477241U JP H0477241 U JPH0477241 U JP H0477241U JP 12134090 U JP12134090 U JP 12134090U JP 12134090 U JP12134090 U JP 12134090U JP H0477241 U JPH0477241 U JP H0477241U
Authority
JP
Japan
Prior art keywords
wafer
lot
average processing
test
processing time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12134090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12134090U priority Critical patent/JPH0477241U/ja
Publication of JPH0477241U publication Critical patent/JPH0477241U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案を示すブロツク図、第2図は一
実施例を示すブロツク図、第3図は一実施例の動
作を示すフローチヤート図である。 2……ウエハプローバ、4……平均処理時間算
出部、6……ロツトウエハ枚数設定部、8……ロ
ツトテスト終了時刻算出分、10……デイスプレ
ー装置。
FIG. 1 is a block diagram showing the present invention, FIG. 2 is a block diagram showing one embodiment, and FIG. 3 is a flowchart showing the operation of one embodiment. 2...Wafer prober, 4...Average processing time calculation section, 6...Rot wafer number setting section, 8...Rot test end time calculation, 10...Display device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 1枚のウエハのテストが終了するたびに信号を
発生するウエハプローバと、ウエハプローバから
の信号を入力し、1枚のウエハのテストに要する
平均処理時間を算出する平均処理時間算出部と、
ロツトに含まれるウエハ枚数が設定されるロツト
ウエハ枚数設定部と、平均処理時間算出部で算出
された平均処理時間とロツトウエハ枚数設定部に
設定されたウエハ枚数とからそのロツトのテスト
終了時刻を算出するロツトテスト終了時刻算出部
と、算出されたロツトテスト終了時刻を表示する
デイスプレー装置とを備えたウエハテスト終了時
刻予告装置。
a wafer prober that generates a signal each time a test of one wafer is completed; an average processing time calculation unit that receives the signal from the wafer prober and calculates the average processing time required to test one wafer;
The test end time for the lot is calculated from the lot wafer number setting section where the number of wafers included in the lot is set, the average processing time calculated by the average processing time calculation section, and the number of wafers set in the lot wafer number setting section. A wafer test end time notification device comprising a lot test end time calculation section and a display device for displaying the calculated lot test end time.
JP12134090U 1990-11-19 1990-11-19 Pending JPH0477241U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12134090U JPH0477241U (en) 1990-11-19 1990-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12134090U JPH0477241U (en) 1990-11-19 1990-11-19

Publications (1)

Publication Number Publication Date
JPH0477241U true JPH0477241U (en) 1992-07-06

Family

ID=31869199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12134090U Pending JPH0477241U (en) 1990-11-19 1990-11-19

Country Status (1)

Country Link
JP (1) JPH0477241U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142197A (en) * 2010-01-07 2011-07-21 Hitachi High-Technologies Corp Inspection device and inspection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142197A (en) * 2010-01-07 2011-07-21 Hitachi High-Technologies Corp Inspection device and inspection method

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