JPH0477234U - - Google Patents
Info
- Publication number
- JPH0477234U JPH0477234U JP1990120507U JP12050790U JPH0477234U JP H0477234 U JPH0477234 U JP H0477234U JP 1990120507 U JP1990120507 U JP 1990120507U JP 12050790 U JP12050790 U JP 12050790U JP H0477234 U JPH0477234 U JP H0477234U
- Authority
- JP
- Japan
- Prior art keywords
- stamp head
- hole
- island
- soft solder
- mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120507U JPH0477234U (enExample) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120507U JPH0477234U (enExample) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477234U true JPH0477234U (enExample) | 1992-07-06 |
Family
ID=31868409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120507U Pending JPH0477234U (enExample) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477234U (enExample) |
-
1990
- 1990-11-16 JP JP1990120507U patent/JPH0477234U/ja active Pending