JPH0477234U - - Google Patents

Info

Publication number
JPH0477234U
JPH0477234U JP12050790U JP12050790U JPH0477234U JP H0477234 U JPH0477234 U JP H0477234U JP 12050790 U JP12050790 U JP 12050790U JP 12050790 U JP12050790 U JP 12050790U JP H0477234 U JPH0477234 U JP H0477234U
Authority
JP
Japan
Prior art keywords
stamp head
hole
island
soft solder
mounter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12050790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12050790U priority Critical patent/JPH0477234U/ja
Publication of JPH0477234U publication Critical patent/JPH0477234U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP12050790U 1990-11-16 1990-11-16 Pending JPH0477234U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12050790U JPH0477234U (enrdf_load_stackoverflow) 1990-11-16 1990-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12050790U JPH0477234U (enrdf_load_stackoverflow) 1990-11-16 1990-11-16

Publications (1)

Publication Number Publication Date
JPH0477234U true JPH0477234U (enrdf_load_stackoverflow) 1992-07-06

Family

ID=31868409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12050790U Pending JPH0477234U (enrdf_load_stackoverflow) 1990-11-16 1990-11-16

Country Status (1)

Country Link
JP (1) JPH0477234U (enrdf_load_stackoverflow)

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