JPH0476281U - - Google Patents
Info
- Publication number
- JPH0476281U JPH0476281U JP11857190U JP11857190U JPH0476281U JP H0476281 U JPH0476281 U JP H0476281U JP 11857190 U JP11857190 U JP 11857190U JP 11857190 U JP11857190 U JP 11857190U JP H0476281 U JPH0476281 U JP H0476281U
- Authority
- JP
- Japan
- Prior art keywords
- ground pattern
- main body
- line connection
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11857190U JPH0476281U (fr) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11857190U JPH0476281U (fr) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476281U true JPH0476281U (fr) | 1992-07-03 |
Family
ID=31866516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11857190U Pending JPH0476281U (fr) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476281U (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007138843A1 (fr) * | 2006-05-31 | 2007-12-06 | Nec Corporation | dispositif de carte de circuit, procÉdÉ pour connecter des tableaux de connexions et dispositif de module de substrat de circuit |
| JP2009076257A (ja) * | 2007-09-19 | 2009-04-09 | Japan Aviation Electronics Industry Ltd | 電気接続部材、ｉｃ検査用ソケット |
| JP2009238728A (ja) * | 2008-03-07 | 2009-10-15 | Three M Innovative Properties Co | 基板用電線接続構造体及び中継接続体の製造方法並びに中継接続体の固定方法 |
-
1990
- 1990-11-14 JP JP11857190U patent/JPH0476281U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007138843A1 (fr) * | 2006-05-31 | 2007-12-06 | Nec Corporation | dispositif de carte de circuit, procÉdÉ pour connecter des tableaux de connexions et dispositif de module de substrat de circuit |
| JP2009076257A (ja) * | 2007-09-19 | 2009-04-09 | Japan Aviation Electronics Industry Ltd | 電気接続部材、ｉｃ検査用ソケット |
| JP4589952B2 (ja) * | 2007-09-19 | 2010-12-01 | 日本航空電子工業株式会社 | 電気接続部材、ｉｃ検査用ソケット |
| JP2009238728A (ja) * | 2008-03-07 | 2009-10-15 | Three M Innovative Properties Co | 基板用電線接続構造体及び中継接続体の製造方法並びに中継接続体の固定方法 |