JPH0476056U - - Google Patents
Info
- Publication number
- JPH0476056U JPH0476056U JP12058290U JP12058290U JPH0476056U JP H0476056 U JPH0476056 U JP H0476056U JP 12058290 U JP12058290 U JP 12058290U JP 12058290 U JP12058290 U JP 12058290U JP H0476056 U JPH0476056 U JP H0476056U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor encapsulation
- encapsulation device
- semiconductor
- combination
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12058290U JPH0476056U (zh) | 1990-11-15 | 1990-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12058290U JPH0476056U (zh) | 1990-11-15 | 1990-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476056U true JPH0476056U (zh) | 1992-07-02 |
Family
ID=31868481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12058290U Pending JPH0476056U (zh) | 1990-11-15 | 1990-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476056U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001099189A1 (en) * | 2000-06-19 | 2001-12-27 | Advantest Corporation | Method and apparatus for edge connection between elements of an integrated circuit |
| KR100502119B1 (ko) * | 2000-06-19 | 2005-07-19 | 가부시키가이샤 어드밴티스트 | 접촉 구조물 및 그 조립 기구 |
-
1990
- 1990-11-15 JP JP12058290U patent/JPH0476056U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001099189A1 (en) * | 2000-06-19 | 2001-12-27 | Advantest Corporation | Method and apparatus for edge connection between elements of an integrated circuit |
| KR100502119B1 (ko) * | 2000-06-19 | 2005-07-19 | 가부시키가이샤 어드밴티스트 | 접촉 구조물 및 그 조립 기구 |
| CN1305181C (zh) * | 2000-06-19 | 2007-03-14 | 株式会社鼎新 | 接触构件 |