JPH0476050U - - Google Patents

Info

Publication number
JPH0476050U
JPH0476050U JP1990119444U JP11944490U JPH0476050U JP H0476050 U JPH0476050 U JP H0476050U JP 1990119444 U JP1990119444 U JP 1990119444U JP 11944490 U JP11944490 U JP 11944490U JP H0476050 U JPH0476050 U JP H0476050U
Authority
JP
Japan
Prior art keywords
power semiconductor
terminal
semiconductor device
nickel
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990119444U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119444U priority Critical patent/JPH0476050U/ja
Publication of JPH0476050U publication Critical patent/JPH0476050U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1990119444U 1990-11-14 1990-11-14 Pending JPH0476050U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119444U JPH0476050U (enFirst) 1990-11-14 1990-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119444U JPH0476050U (enFirst) 1990-11-14 1990-11-14

Publications (1)

Publication Number Publication Date
JPH0476050U true JPH0476050U (enFirst) 1992-07-02

Family

ID=31867401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119444U Pending JPH0476050U (enFirst) 1990-11-14 1990-11-14

Country Status (1)

Country Link
JP (1) JPH0476050U (enFirst)

Similar Documents

Publication Publication Date Title
JPH0476050U (enFirst)
JPS62160552U (enFirst)
JPS62186461U (enFirst)
JPH0412659U (enFirst)
JPH03126361U (enFirst)
JPS63170964U (enFirst)
JPS6380889U (enFirst)
JPH03106755U (enFirst)
JPS63102348U (enFirst)
JPS6390802U (enFirst)
JPH01152454U (enFirst)
JPH0166763U (enFirst)
JPS62152451U (enFirst)
JPH03110854U (enFirst)
JPS62126867U (enFirst)
JPS6153945U (enFirst)
JPS61100174U (enFirst)
JPH0459071U (enFirst)
JPS59177187U (ja) 配線器具
JPS61203577U (enFirst)
JPH01146542U (enFirst)
JPS61166536U (enFirst)
JPH03126362U (enFirst)
JPS61183087U (enFirst)
JPS6398655U (enFirst)