JPH04756U - - Google Patents
Info
- Publication number
- JPH04756U JPH04756U JP1990040378U JP4037890U JPH04756U JP H04756 U JPH04756 U JP H04756U JP 1990040378 U JP1990040378 U JP 1990040378U JP 4037890 U JP4037890 U JP 4037890U JP H04756 U JPH04756 U JP H04756U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- heat dissipation
- dissipation fin
- fin block
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005219 brazing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990040378U JPH04756U (es) | 1990-04-16 | 1990-04-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990040378U JPH04756U (es) | 1990-04-16 | 1990-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04756U true JPH04756U (es) | 1992-01-07 |
Family
ID=31550118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990040378U Pending JPH04756U (es) | 1990-04-16 | 1990-04-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04756U (es) |
-
1990
- 1990-04-16 JP JP1990040378U patent/JPH04756U/ja active Pending