JPH04755U - - Google Patents

Info

Publication number
JPH04755U
JPH04755U JP3893790U JP3893790U JPH04755U JP H04755 U JPH04755 U JP H04755U JP 3893790 U JP3893790 U JP 3893790U JP 3893790 U JP3893790 U JP 3893790U JP H04755 U JPH04755 U JP H04755U
Authority
JP
Japan
Prior art keywords
thermosetting resin
insulating substrate
copper foil
sealed
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3893790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3893790U priority Critical patent/JPH04755U/ja
Publication of JPH04755U publication Critical patent/JPH04755U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP3893790U 1990-04-11 1990-04-11 Pending JPH04755U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3893790U JPH04755U (US20090163788A1-20090625-C00002.png) 1990-04-11 1990-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3893790U JPH04755U (US20090163788A1-20090625-C00002.png) 1990-04-11 1990-04-11

Publications (1)

Publication Number Publication Date
JPH04755U true JPH04755U (US20090163788A1-20090625-C00002.png) 1992-01-07

Family

ID=31547390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3893790U Pending JPH04755U (US20090163788A1-20090625-C00002.png) 1990-04-11 1990-04-11

Country Status (1)

Country Link
JP (1) JPH04755U (US20090163788A1-20090625-C00002.png)

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