JPH0474430U - - Google Patents

Info

Publication number

JPH0474430U

JPH0474430U JP11681890U JP11681890U JPH0474430U JP H0474430 U JPH0474430 U JP H0474430U JP 11681890 U JP11681890 U JP 11681890U JP 11681890 U JP11681890 U JP 11681890U JP H0474430 U JPH0474430 U JP H0474430U

Authority

JP

Japan

Prior art keywords

lead frame

bonding

heater block

integrated circuit

hereinafter referred

Prior art date

1990-11-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
• 238000010438 heat treatment Methods 0.000 claims 1
• 239000002184 metal Substances 0.000 claims 1
• 239000004065 semiconductor Substances 0.000 claims 1
• 229910052710 silicon Inorganic materials 0.000 claims 1
• 239000010703 silicon Substances 0.000 claims 1