JPH04743U - - Google Patents
Info
- Publication number
- JPH04743U JPH04743U JP4093390U JP4093390U JPH04743U JP H04743 U JPH04743 U JP H04743U JP 4093390 U JP4093390 U JP 4093390U JP 4093390 U JP4093390 U JP 4093390U JP H04743 U JPH04743 U JP H04743U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- chip
- flexible wiring
- tab
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4093390U JPH04743U (ko) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4093390U JPH04743U (ko) | 1990-04-17 | 1990-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04743U true JPH04743U (ko) | 1992-01-07 |
Family
ID=31551161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4093390U Pending JPH04743U (ko) | 1990-04-17 | 1990-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04743U (ko) |
-
1990
- 1990-04-17 JP JP4093390U patent/JPH04743U/ja active Pending