JPH0473133U - - Google Patents
Info
- Publication number
- JPH0473133U JPH0473133U JP11640290U JP11640290U JPH0473133U JP H0473133 U JPH0473133 U JP H0473133U JP 11640290 U JP11640290 U JP 11640290U JP 11640290 U JP11640290 U JP 11640290U JP H0473133 U JPH0473133 U JP H0473133U
- Authority
- JP
- Japan
- Prior art keywords
- board
- eaves
- sealing material
- roof
- horizontal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Building Environments (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11640290U JPH0473133U (fi) | 1990-11-05 | 1990-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11640290U JPH0473133U (fi) | 1990-11-05 | 1990-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0473133U true JPH0473133U (fi) | 1992-06-26 |
Family
ID=31864225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11640290U Pending JPH0473133U (fi) | 1990-11-05 | 1990-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0473133U (fi) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587869U (ja) * | 1981-07-08 | 1983-01-19 | 日本鉱業株式会社 | 電解アノ−ド支承装置 |
| JPS635534A (ja) * | 1986-06-25 | 1988-01-11 | Matsushita Electronics Corp | 半導体装置の製造方法 |
-
1990
- 1990-11-05 JP JP11640290U patent/JPH0473133U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587869U (ja) * | 1981-07-08 | 1983-01-19 | 日本鉱業株式会社 | 電解アノ−ド支承装置 |
| JPS635534A (ja) * | 1986-06-25 | 1988-01-11 | Matsushita Electronics Corp | 半導体装置の製造方法 |