JPH0472657U - - Google Patents
Info
- Publication number
- JPH0472657U JPH0472657U JP11468890U JP11468890U JPH0472657U JP H0472657 U JPH0472657 U JP H0472657U JP 11468890 U JP11468890 U JP 11468890U JP 11468890 U JP11468890 U JP 11468890U JP H0472657 U JPH0472657 U JP H0472657U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- boss
- light
- main body
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11468890U JPH0472657U (fr) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11468890U JPH0472657U (fr) | 1990-11-02 | 1990-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0472657U true JPH0472657U (fr) | 1992-06-26 |
Family
ID=31862395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11468890U Pending JPH0472657U (fr) | 1990-11-02 | 1990-11-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0472657U (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010422A (ja) * | 2006-06-26 | 2008-01-17 | Osram Sylvania Inc | 直視レンズ付きの発光ダイオード |
JP2021166223A (ja) * | 2020-04-06 | 2021-10-14 | 三菱電機株式会社 | 半導体装置、半導体装置を搭載した回路基板、電力変換装置および半導体装置を搭載した回路基板の製造方法 |
-
1990
- 1990-11-02 JP JP11468890U patent/JPH0472657U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010422A (ja) * | 2006-06-26 | 2008-01-17 | Osram Sylvania Inc | 直視レンズ付きの発光ダイオード |
EP1873566B1 (fr) * | 2006-06-26 | 2017-11-22 | OSRAM GmbH | Diode luminescente avec ensemble guide de lumière |
JP2021166223A (ja) * | 2020-04-06 | 2021-10-14 | 三菱電機株式会社 | 半導体装置、半導体装置を搭載した回路基板、電力変換装置および半導体装置を搭載した回路基板の製造方法 |