JPH0472656U - - Google Patents

Info

Publication number
JPH0472656U
JPH0472656U JP11468790U JP11468790U JPH0472656U JP H0472656 U JPH0472656 U JP H0472656U JP 11468790 U JP11468790 U JP 11468790U JP 11468790 U JP11468790 U JP 11468790U JP H0472656 U JPH0472656 U JP H0472656U
Authority
JP
Japan
Prior art keywords
avalanche photodiode
temperature detection
peltier element
detection element
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11468790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11468790U priority Critical patent/JPH0472656U/ja
Publication of JPH0472656U publication Critical patent/JPH0472656U/ja
Pending legal-status Critical Current

Links

JP11468790U 1990-11-02 1990-11-02 Pending JPH0472656U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11468790U JPH0472656U (zh) 1990-11-02 1990-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11468790U JPH0472656U (zh) 1990-11-02 1990-11-02

Publications (1)

Publication Number Publication Date
JPH0472656U true JPH0472656U (zh) 1992-06-26

Family

ID=31862394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11468790U Pending JPH0472656U (zh) 1990-11-02 1990-11-02

Country Status (1)

Country Link
JP (1) JPH0472656U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component
US9245838B2 (en) 2000-09-25 2016-01-26 Ibiden Co., Ltd. Semiconductor element

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