JPH0472650U - - Google Patents

Info

Publication number
JPH0472650U
JPH0472650U JP11655190U JP11655190U JPH0472650U JP H0472650 U JPH0472650 U JP H0472650U JP 11655190 U JP11655190 U JP 11655190U JP 11655190 U JP11655190 U JP 11655190U JP H0472650 U JPH0472650 U JP H0472650U
Authority
JP
Japan
Prior art keywords
component
circuit board
integrated circuit
resistor
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11655190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11655190U priority Critical patent/JPH0472650U/ja
Publication of JPH0472650U publication Critical patent/JPH0472650U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP11655190U 1990-11-06 1990-11-06 Pending JPH0472650U (US06294698-20010925-C00026.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11655190U JPH0472650U (US06294698-20010925-C00026.png) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11655190U JPH0472650U (US06294698-20010925-C00026.png) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472650U true JPH0472650U (US06294698-20010925-C00026.png) 1992-06-26

Family

ID=31864385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11655190U Pending JPH0472650U (US06294698-20010925-C00026.png) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472650U (US06294698-20010925-C00026.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018043076A1 (ja) * 2016-09-01 2018-03-08 日立金属株式会社 絶縁基板およびこれを用いた半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601847A (ja) * 1983-06-20 1985-01-08 Toshiba Corp 混成集積回路
JPH01179352A (ja) * 1987-12-30 1989-07-17 Nec Corp 半導体集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601847A (ja) * 1983-06-20 1985-01-08 Toshiba Corp 混成集積回路
JPH01179352A (ja) * 1987-12-30 1989-07-17 Nec Corp 半導体集積回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018043076A1 (ja) * 2016-09-01 2018-03-08 日立金属株式会社 絶縁基板およびこれを用いた半導体装置
US10559509B2 (en) 2016-09-01 2020-02-11 Hitachi Metals, Ltd. Insulating substrate and semiconductor device using same

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