JPH0472643U - - Google Patents

Info

Publication number
JPH0472643U
JPH0472643U JP11690990U JP11690990U JPH0472643U JP H0472643 U JPH0472643 U JP H0472643U JP 11690990 U JP11690990 U JP 11690990U JP 11690990 U JP11690990 U JP 11690990U JP H0472643 U JPH0472643 U JP H0472643U
Authority
JP
Japan
Prior art keywords
heat sink
plate spring
mounting
electronic component
fit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11690990U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11690990U priority Critical patent/JPH0472643U/ja
Publication of JPH0472643U publication Critical patent/JPH0472643U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP11690990U 1990-11-05 1990-11-05 Pending JPH0472643U (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11690990U JPH0472643U (ru) 1990-11-05 1990-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11690990U JPH0472643U (ru) 1990-11-05 1990-11-05

Publications (1)

Publication Number Publication Date
JPH0472643U true JPH0472643U (ru) 1992-06-26

Family

ID=31864763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11690990U Pending JPH0472643U (ru) 1990-11-05 1990-11-05

Country Status (1)

Country Link
JP (1) JPH0472643U (ru)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010205830A (ja) * 2009-03-02 2010-09-16 Fujitsu Telecom Networks Ltd 半導体素子の取付構造
JP2014227697A (ja) * 2013-05-21 2014-12-08 アイシン精機株式会社 熱交換ユニットおよび人体局部洗浄装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010205830A (ja) * 2009-03-02 2010-09-16 Fujitsu Telecom Networks Ltd 半導体素子の取付構造
JP2014227697A (ja) * 2013-05-21 2014-12-08 アイシン精機株式会社 熱交換ユニットおよび人体局部洗浄装置

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