JPH0472628U - - Google Patents
Info
- Publication number
- JPH0472628U JPH0472628U JP11477090U JP11477090U JPH0472628U JP H0472628 U JPH0472628 U JP H0472628U JP 11477090 U JP11477090 U JP 11477090U JP 11477090 U JP11477090 U JP 11477090U JP H0472628 U JPH0472628 U JP H0472628U
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- connection lead
- slit
- bending slit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11477090U JPH0472628U (zh) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11477090U JPH0472628U (zh) | 1990-11-02 | 1990-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0472628U true JPH0472628U (zh) | 1992-06-26 |
Family
ID=31862485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11477090U Pending JPH0472628U (zh) | 1990-11-02 | 1990-11-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0472628U (zh) |
-
1990
- 1990-11-02 JP JP11477090U patent/JPH0472628U/ja active Pending