JPH0470778U - - Google Patents
Info
- Publication number
- JPH0470778U JPH0470778U JP11452590U JP11452590U JPH0470778U JP H0470778 U JPH0470778 U JP H0470778U JP 11452590 U JP11452590 U JP 11452590U JP 11452590 U JP11452590 U JP 11452590U JP H0470778 U JPH0470778 U JP H0470778U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- main body
- operation surface
- lead
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002265 prevention Effects 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000010977 unit operation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 3
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案の一実施例を示すテストフイク
スチヤの全体構成を示す図である。第２図ははみ
出し防止板の作用を説明するための図である。第
３図はテストリードの先端が本体とカバーとの間
から外にはみ出る状態を示す図である。第４図は
アングルと溝部との間にテストリードが挟まれな
いときの状態を示す図である。第５図は同じくテ
ストリードが挟まれたときの状態を示す図である
。第６図はテストリードが本体とカバーとの間に
挟まれた場合に、これを電気的に検知する機構を
示す図である。第７図は本体とカバーとの間にテ
ストリードが挟まれない場合において、接点が各
導体を短絡した状態を示す図である。第８図は同
じく接点が各導体を短絡していない状態を示す図
である。第９図は従来のテストフイクスチヤの全
体構成を示す図である。第１０図はテストフイク
スチヤのリアパネルを示す図である。第１１図は
テストリードがカバーを閉じた場合にカバー外部
にはみ出した状態を示す図である。
１……本体、２……カバー、４……リード線（
テストリード）、８……操作面、９……長尺溝部
、１０，１６……長尺体の長尺溝への挿入の有無
を検知する手段（１０……スイツチ穴、１６……
ピン）、１３……長尺体（アングル）、１５……
はみ出し防止板、２１……電気的に開いた回路（
導体）、２２……接点、２４……回路の電気的な
開閉を検知する手段。
FIG. 1 is a diagram showing the overall configuration of a test fixture showing an embodiment of the present invention. FIG. 2 is a diagram for explaining the function of the extrusion prevention plate. FIG. 3 is a diagram showing a state in which the tips of the test leads protrude from between the main body and the cover. FIG. 4 is a diagram showing a state when the test lead is not caught between the angle and the groove. FIG. 5 is a diagram similarly showing the state when the test lead is pinched. FIG. 6 is a diagram showing a mechanism for electrically detecting when a test lead is caught between the main body and the cover. FIG. 7 is a diagram showing a state in which the contacts short-circuit each conductor when the test leads are not sandwiched between the main body and the cover. FIG. 8 is a diagram similarly showing a state in which the contacts do not short-circuit each conductor. FIG. 9 is a diagram showing the overall configuration of a conventional test fixture. FIG. 10 is a diagram showing the rear panel of the test fixture. FIG. 11 is a diagram showing a state in which the test leads protrude outside the cover when the cover is closed. 1...Body, 2...Cover, 4...Lead wire (
Test lead), 8... Operation surface, 9... Long groove portion, 10, 16... Means for detecting whether or not the elongated body is inserted into the long groove (10... Switch hole, 16...
pin), 13...long body (angle), 15...
Extrusion prevention plate, 21...Electrically open circuit (
conductor), 22...contact, 24...means for detecting electrical opening/closing of the circuit.
Claims (1)
、リード結線が本体操作面で行われる該電子機器
のリード線のはみ出し防止機構において、 該電子機器の奥側であつて、カバーと本体操作
面との間に、カバー側、本体側の少なくとも一方
に、固定状態または摺動可能状態で支承されて壁
面を構成するはみ出し防止板を設けてなることを
特徴とするリード線のはみ出し防止機構。 (2) カバーを有する電子機器であつて、リード
結線が本体操作面で行われる該電子機器のリード
線のはみ出し防止機構において、 本体操作面、カバーの何れか一方に長尺溝部を
設け、他方に該長尺溝部に適合する長尺体を設け
ると共に、該長尺体の長尺溝部への挿入の有無を
検知する手段を有してなることを特徴とするリー
ド線のはみ出し防止機構。 (3) カバーを有する電子機器であつて、リード
結線が本体操作面で行われる該電子機器のリード
線のはみ出し防止機構において、 カバーの本体操作面に対向する側の周囲に少な
くとも一箇所が電気的に開いてなる回路を設け、
本体操作面にカバーが完全に閉じられた場合に上
記回路を電気的に閉じる接点を設けると共に、上
記回路の電気的な開閉を検知する手段を有してな
ることを特徴とするリード線のはみ出し防止機構
。[Scope of Claim for Utility Model Registration] (1) In a mechanism for preventing the protrusion of lead wires of an electronic device having a rotary cover, in which the lead wires are connected on the operation surface of the device, the back side of the electronic device The device is characterized in that an extrusion prevention plate is provided between the cover and the main unit operation surface, and is supported on at least one of the cover side and the main body side in a fixed state or a slidable state and forms a wall surface. Mechanism to prevent lead wires from protruding. (2) In a lead wire protrusion prevention mechanism for an electronic device that has a cover and in which lead connections are made on the operation surface of the main body, a long groove is provided on either the operation surface of the main body or the cover, and a long groove is provided on the other side. A lead wire protrusion prevention mechanism, comprising: an elongate body that fits into the elongate groove; and means for detecting whether or not the elongate body is inserted into the elongate groove. (3) In an electronic device having a cover, in which lead connections are made on the operation surface of the main body, at least one point around the side of the cover facing the operation surface of the main body is electrically connected. Create a circuit that is open to the target,
The protrusion of the lead wire is characterized in that the operating surface of the main body is provided with a contact that electrically closes the circuit when the cover is completely closed, and has means for detecting electrical opening/closing of the circuit. Prevention mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114525U JP2507127Y2 (en) | 1990-10-31 | 1990-10-31 | Lead wire protrusion prevention mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114525U JP2507127Y2 (en) | 1990-10-31 | 1990-10-31 | Lead wire protrusion prevention mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0470778U true JPH0470778U (en) | 1992-06-23 |
| JP2507127Y2 JP2507127Y2 (en) | 1996-08-14 |
Family
ID=31862215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990114525U Expired - Fee Related JP2507127Y2 (en) | 1990-10-31 | 1990-10-31 | Lead wire protrusion prevention mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507127Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006149741A (en) * | 2004-11-30 | 2006-06-15 | Samii Kk | Box type game machine |
| JP2011073800A (en) * | 2009-09-29 | 2011-04-14 | Hitachi Ltd | Elevator device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172188U (en) * | 1987-04-30 | 1988-11-09 |
-
1990
- 1990-10-31 JP JP1990114525U patent/JP2507127Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63172188U (en) * | 1987-04-30 | 1988-11-09 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006149741A (en) * | 2004-11-30 | 2006-06-15 | Samii Kk | Box type game machine |
| JP2011073800A (en) * | 2009-09-29 | 2011-04-14 | Hitachi Ltd | Elevator device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2507127Y2 (en) | 1996-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |