JPH0470283U - - Google Patents
Info
- Publication number
- JPH0470283U JPH0470283U JP11144290U JP11144290U JPH0470283U JP H0470283 U JPH0470283 U JP H0470283U JP 11144290 U JP11144290 U JP 11144290U JP 11144290 U JP11144290 U JP 11144290U JP H0470283 U JPH0470283 U JP H0470283U
- Authority
- JP
- Japan
- Prior art keywords
- sheet body
- solder
- balls
- view
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図ないし第４図は一実施例を示し、第１図
は平面図、第２図は一部拡大斜視図、第３図は製
造方法を説明する斜視図、第４図は一部拡大断面
図、第５図は一個のボールハンダの固定状態をさ
らに拡大して示す断面図である。第６図は他の実
施例を示す一部拡大断面図である。
Ｓ……配列済ボールハンダ、１……面状体、３
……ボールハンダ。
Figures 1 to 4 show one embodiment, Figure 1 is a plan view, Figure 2 is a partially enlarged perspective view, Figure 3 is a perspective view explaining the manufacturing method, and Figure 4 is a partially enlarged perspective view. 5 is a further enlarged cross-sectional view showing a fixed state of one ball solder. FIG. 6 is a partially enlarged sectional view showing another embodiment. S... Arranged ball solder, 1... Planar body, 3
...Ball solder.
Claims (1)
された多数のボールハンダ３を規則的に間隔を置
いて配列し、面状体１の上に固定したことを特徴
とする配列済ボールハンダ。 Arranged balls characterized in that a large number of granular solder balls 3 are arranged at regular intervals on the upper surface of a heat-resistant sheet body 1 and fixed on the sheet body 1. Solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11144290U JPH0470283U (en) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11144290U JPH0470283U (en) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470283U true JPH0470283U (en) | 1992-06-22 |
Family
ID=31858898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11144290U Pending JPH0470283U (en) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470283U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS478429U (en) * | 1971-02-22 | 1972-10-02 |
-
1990
- 1990-10-23 JP JP11144290U patent/JPH0470283U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS478429U (en) * | 1971-02-22 | 1972-10-02 |