JPH0469990A - Manufacture of printed circuit board - Google Patents

Abstract

PURPOSE:To obtain a printed circuit board by electrodepositing light curable anionic electrodepositing paint on a copper-plated laminated plate, then developing a coated film exposed through a negative film with weak alkaline solution, removing the exposed copper by etching, and further peeling the remaining film with strong alkaline solution. CONSTITUTION:A photosensitive resist film in which light curable electrodeposited film is coated with aqueous soluble or aqueous dispersive resin or electrodeposited with anionic electrodepositing paint, is dried, pattern-masked, and exposed with an active light ray such as an ultraviolet ray. It is developed by spraying weak alkaline water on the film surface and washing the uncured part of the film. Then, a copper foil exposed on the board by developing is removed by etching by using alkaline etchant. After etching, the cured film on the circuit pattern is dissolved to be removed with strong aqueous alkaline solution such as 3-10% of caustic soda, caustic potash, and a printed circuit is formed on the board.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board, and more specifically
In particular, it is possible to coat a copper clad laminate with 1I to form a smooth coating 5, and to form a coating that is easily cured by active light such as ultraviolet rays through negative or positive film. in,
Printed wiring with alkali edging resistance) O1
- This invention relates to a method for manufacturing a printed wiring board using an anionic electrodeposition paint for resist.

[Conventional technology and its problems] Conventionally, photocurable coatings obtained by anionic electrodeposition have been used to create a uniform coating film that is developable and has excellent UV curability on the surface of copper-clad laminates. Printed wiring photoresists have been obtained that can be formed. Currently, most printed wiring board manufacturers use alkali-soluble dry film or anionic 1F@-type photoresists as etching photoresists, and use weak alkaline development and copper or iron chloride as the main ingredients. acid etching,
Printed wiring boards are manufactured by peeling with strong alkali.

In some cases, solvent-soluble or acid-soluble dry films or cationic N@-type photoresists are used, and solvent or weak acid development, alkaline etching containing ammonium chloride or ammonia as the main component, and peeling with solvents or strong acids are used. Printed wiring boards are manufactured.

However, in the former case, acidic etching agents tend to generate free chlorine (which causes air pollution such as acid rain, and safety and hygiene problems. Additionally, there are problems in that the etching solution is complicated to manage). be.

In addition, in the latter situation, even when stripping is performed using a solvent, there are problems with air pollution, safety, and hygiene due to volatilization of the solvent, and development,
When stripping is performed using acid, there is a problem that the equipment is corroded by the acid, which increases the equipment cost.

Therefore, in recent years, printed wiring board manufacturers have strongly desired the development of a method for manufacturing printed wiring boards using weak alkaline development, alkaline etching, and strong alkaline peeling.

Means for Solving Problem E] As a result of intensive research in order to find a technical means to solve the above problem, the inventors of the present invention applied electrodeposition coating to a copper-clad laminate to make it photosensitive. By using a resin with a low unsaturation equivalent (and a low glass transition temperature) as an anionic electrodeposition type photocurable resin used to form a resist film, a sufficiently crosslinked cured film can be obtained with a small amount of exposure, and the resist It was discovered that the film could withstand alkali etching, and the present invention was completed.

Thus, according to the present invention, after a photocurable anionic electrodeposition paint is electrodeposited on a copper-clad laminate, the exposed copper film is developed with a weak alkaline solution through a negative film, and then the exposed copper is removed. is removed by etching with an alkaline etching solution, and the remaining coating film is further peeled off with a strong alkaline solution to obtain a printed wiring board.

According to the present invention, an unsaturated equivalent of 40 is obtained by adding a compound having a polymerizable unsaturated bond and a glycidyl group in the molecule to a high acid value acrylic resin, using the photocurable anion 1 as a vehicle in the paint coating.
0 or less, an acid value of 20 to 300, and a glass transition temperature of 15° C. or less, the main component is a water-soluble or water-dispersible polymerizable unsaturated resin.

The photocurable anionic electrodeposition coating composition used in the method of the present invention is basically an anionic electrodeposition composition containing a water-soluble or water-dispersible polymerizable unsaturated resin and a photopolymerization initiator as main components. be.

This polymerizable unsaturated resin includes, for example, a high acid value acrylic resin obtained by copolymerizing an unsaturated acid such as acrylic acid or methacrylic acid with another acrylic monomer, glycidyl acrylate, or glycidyl acrylate.

It includes resins in which a compound having a polymerizable unsaturated bond and a glycidyl group is added to one molecule, such as methacrylate.

Examples of acrylic monomers that are copolymerized with unsaturated acids such as acrylic acid and methacrylic acid in order to withstand alkali etching include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 1so-butyl acrylate, 1so-butyl methacrylate, tert-butyl acrylate, tert-'butyl methacrylate, propyl acrylate, probyl methacrylate, acrylic acid...\yauru, hesyl methacrylate, acrylic acid,
4-ethyl methacrylate, lauryl acrylate, τtubanolyl acrylate, acrylic% 2-s, 1,000 J1.
\A-sil, methacrylic acid 2-eral/\hezyl, no'acrylic acid 7 Acidin 7 allyl, Su・BuL, N, Vinyltord,′, Methyl, Suf1/〉・, Ri0Russu I・N, Acetate peafur, Vinyl chloride; Methyl
：ni, l・ril, 2-ethylh ¥zyl s′nil j, −
There are ``Puru'', ``Sijiflu Benzene'', etc.

In addition, 2-droxygotyl acrylate, 2-hydroxygotyl methacrylate, 2-hydroxypropyl acrylate, 2-pidroxib Libiru methacrylate, diaseptone acrylamide, etc. can also be used in hydrophilic stingers: cenomer 2, but these should be used in small amounts. If you increase it, it will be 15.
It is preferable to use less than 20% by weight of i:2O in the unsaturated acrylic resin, since the film's orientation and tackiness will be poor (J).
2. Polymerizable unsaturated resin 1 t,;i unsaturated equivalent 400
1・(preferably l, <4; l: niji()()to・33
0) Glass transition i=1. Door F I F 5° (
Good It: L-, < is 2. to OX゛□ 15℃)
Toma), one more step 1' song 20~:'300 (good V
at, < 40...170), mu: 1. +51'
→■′ Certain 1, OOOLl, L,,,,1 (IaT
*1. ,,, < is: 3, (1) 00-・
・30.000)”!-′”・)ru, °, 1 go or good i
1. j = ゛J,・) 16, non-cll equivalent amount 400 or more 1-1, gas transition, ・quality 1; 3° (if it becomes 1, the alkali drop-f ・g 1 consideration ≧) hardening , the amount of exposure to obtain 1 grain is high, 1, 2' - yield 1 grain is low 1, -4
1, Exposure of the film 1i11'' (,j resolution point or d,
3) When irradiated with ultraviolet light of 0.420 nm, ultraviolet light)
Niji < is 2E50 mJ, / cn (''), which corresponds to the IIL productivity of the printed wiring board.

If the acid value is lower than 20, the water dispersibility is poor, and the acid fi! 1. !
If the number average molecular weight is less than 1,000, the coating film forming ability will be low.
・Because of this, it is not preferred for practical use.

In the present invention, [the electrodeposition composition used]
Toshi 7″ (-In addition to the above-mentioned resin) - Aitake and vinegar!
Japanese group-containing resins (e.g., polyester resins containing unsaturated groups, polyester resins, polyester resins, acrylic resins, etc.), saturated resins (e.g., polyester resins containing unsaturated groups), saturated resins (e.g. Add 100 parts by weight of resin to 100 parts by weight of polyester resin, polyester resin, ebony resin, acrylic resin, etc.), oligomer (e.g. tribrobylene glycol di(meth)acrylate, etc.). Department and below,
Preferably 1.J is mixed in a range of 50 parts by weight or more and applied.
It is also possible to adjust the membrane performance accordingly.

In the present invention, water dispersion or water solubilization of the polymerizable unsaturated or saturated resin is carried out by neutralizing the carboxyl groups contained in the resin skeleton with an alkali (neutralizing agent). Examples of neutralizing agents include alkanolamines such as monoethanolamine, jetanolamine, and triethanolamine; alkylamines such as triethylamine, diethylamine, monoethylamine, diisopropylamine, trimedelamine, and diisobutylamine; dimethylaminoethylamine; Al A such as nol
Alkanolamines, SikuUIheyanlu7pamu,
Alicyclic amines such as ・, alkali metal hydroxides such as -ti/-da, caustic potash, etc. are the first. , these can be used alone or in mixtures. The amount of the neutralizing agent to be used is preferably 5 to 0.4 to 1.0 equivalent per mole of carfoyacyl group contained in the +-1 group, and less than 0.4 equivalent improves water dispersibility.
1.1. is low -Ft, making electrodeposition coating difficult, and if it exceeds l() equivalent, storage stability is poor.1.1. ．． ．． ．． ．．
．． <No.

Water-solubilized or water-dispersed resins are hydrophilic to improve their fluidity; Ethoxyethanol, butoxyethanol, diethyl glycol 1, methyl j--thyl, dioquinone, tetrahydrosolane, etc. can be added. The amount of hydrophilic solvent used is preferably 300 parts by weight or more per 100 parts by weight of the vehicle component.

In order to increase the amount of coating on the object, hydrophobic solvents such as petroleum solvents such as toluene and xylene; ketones such as methyl ethyl ketone and methyl isobutyl ketone; esters such as ethyl acetate and butyl acetate; 2-ethylhexyl Alcohols such as alcohol; etc. can also be added. The amount of the hydrophobic solvent used is preferably 200 parts by weight or less per 100 parts by weight of the resin component.

In the present invention, the photopolymerization initiator used in combination with the unsaturated resin is not particularly limited as long as it can initiate radical polymerization with actinic rays such as ultraviolet rays.
Typical examples include benzoin, benzoin methyl ether, benzoin ethyl ether, benzyl, diphenyl disulfide, tetramethylthiuram monosulfide, diacetyl, eosin, thionin, Michler's ketone, anthraquinone, chloranthraquinone,
Methyl anthraquinone, α-hydroxyisobutylphenone, p-isopropyl α-hydroxyisobutylphenone, α・α′ dichloro-4-phenoxyacetophenone, 1-hydroxy 1-cyclohexylacetophenone,
2.2 dimethoxy 2-phenylacetophenone, methylbenzoylphotomate, 2-methyl-1-[4-(methylthio)phenyl] 2.morpholino-propene, thioxanthone, benzophenone, etc. can be mentioned, and the amount of these used is The range is preferably from 0.61 to 10 parts by weight based on 100 parts by weight of the resin component (solid content), and less than 0.1 parts by weight is preferable because the curability decreases. Mechanical strength tends to deteriorate.Dye or pigment can also be added if necessary.

Electrodeposition coating for printed wiring photoresists of the present invention is generally carried out as follows.

Electrodeposition of the electrodeposition coating composition is carried out by using an electrodeposition coating bath obtained by dissolving or dispersing the composition in water at a pH of 6.0 to 9 and a bath concentration (solid content concentration) of 3 to 25% by weight, preferably 5 to 25% by weight. 20% by weight
The bath temperature was controlled at 15 to 40°C, preferably 15 to 30°C, and then an insulating substrate covered with copper foil was immersed as an anode in the carefully controlled electrodeposition coating bath, and a constant voltage (1 to 400°C) was applied.
V) or apply a direct current of 1 to 400 mA/d
This is done by applying a constant DC current of 100 m''.Also, a predetermined voltage or current may be applied from the start of energization, or it may be gradually increased to a predetermined current or voltage over a period of 1 to 30 seconds. Good. In this case, the energization time is 30 seconds to 5
minutes is appropriate.

After electrodeposition coating, the object to be coated is taken out of the electrodeposition bath, washed with water, and then dried as is or, if necessary, drained and dried by air blowing, hot air, etc.

In the present invention, in order to protect the surface of the photocurable electrodeposited coating film obtained as described above and to improve the blocking and surface tackiness of the resist film, a water-soluble A water-soluble or water-dispersible resin film is applied, or an anionic electrodeposition paint containing a water-soluble or water-dispersible resin as a main component is electrocoated.

Examples of resins used for applying water-soluble or water-dispersible resin coatings include acid groups (e.g. carboxyl groups) or bases (
Examples include neutralized resins into which amino groups have been introduced, resins that themselves have hydrophilic groups (such as ether groups) in the resin skeleton, and water-dispersed resins in which resins are dispersed in water. The water-soluble or water-dispersible resin needs to have a glass transition temperature of 20°C or higher. Specific examples include polyvinyl alcohol, vinyl acetate resin, water-soluble acrylic resin, etc. Among them, polyvinyl alcohol-based resins are preferred because they are non-sticky, have good film-forming properties, and have good water solubility. . Examples of the method for forming a resin film on a photocurable capacitor coating using the water-soluble or water-dispersible resin include dipping coating, curtain flow coating, air spray coating, and the like.

A method of electrodepositing an anionic electrodeposition paint containing a water-soluble or water-dispersible resin as a main component on a photocurable electrodeposition coating film is described, for example, in JP-A-2-20873. There are several methods. By this method, the water-soluble or water-dispersible resin used in the electrodeposition paint to be electrodeposited in the second stage contains 11-) Guns Nano' polyi
If the benefit m is 20 ``f, '1 or more, -1, then the raw horny unsaturated resin or 1. .Water-soluble is water-dispersible.
1.1, '1-containing hydrophilic group l2. , unsaturated resins such as acrylic resins containing non-unsaturated groups, -6-bodies resins, polyhair slurry resins, polyurethane resins, tan resins, etc. Unsaturated resin, saturated resin 2
・Any resin that can be used for anionic electrodeposition and contains an onic group can be used, but unsaturated resins are better for electrodeposition coating in one step 1"1. 7 is more preferable because it does not reduce the film's sensitivity f().

As mentioned above, after drying, a pattern mask is applied to a photosensitive resist film obtained by coating a water-soluble or water-dispersible resin on a photocurable electrodeposition coating film or by electrodepositing an anionic electrodeposition paint. It can be cleaned by active light such as ultraviolet rays.

The actinic light used for exposure in the present invention differs depending on the type of photopolymerization initiator 1 ↓ Koyo-2, but generally " is 3.00".
0~・4,! □A ray of light with a wavelength of 500 people is J:t
``, these H7, these '5 key 7 sources °ζ human sunlight, wooden silver moon, habit, non-lamp, arc moon, etc. Hardening of the coating film due to [I radiation' of the Nagisa f1 rays] (' is within a few minutes, usually (H1 seconds...-2C) within a range of 16,1 minutes, :...:, the developing process is within 1' of the coating surface. Spray mild alkaline water on ) (・J (7, Unrefined paint film)
This can be done by flushing the 1-0 part. Neutralizes free carbo and N-syl groups present in the coating film, such as weak alkali/alkaline water (, normal soda, carbonated soda, caustic potash, water, etc.) to make it water-soluble. For example, in the case of an aqueous solution of soda carbonate, about 0.1% to 5% is suitable.

, (1) If it is less than 1%, it will be difficult to develop, and if it is more than 5%, it will be difficult to develop.
- Now let's take a look at the image section 1. Fear 1. There is one...
Not.

-) Then, the 7' copper foil part (1 circuit part) exposed on the board by image processing is removed by etching using an alkaline etching solution. .

The alkaline etching solution is used as an alkaline etching solution. The compound and
Sulfuric acid an′-c+:, Lam, Jl, Lianxiao F”〕ha(
-1-・'Tsumu, Iokatlllj acid) 7n-(Toum et al., 8, Ding Tsuchisig(, ↓, cash register "1
．． The optical hard part (circuit part) of l-1ii will not be damaged.11
H8-], carried out in the range of 0), usually ammo-,
Add one part of the bicarbonate and ammonium compound. , pH
Prepare to 8.～.10 11. An aqueous alkaline bamboo solution was used6.
t"li) is particularly suitable for ammonia water and salt solution, and rum is used as a 1° component, and an alkaline etching solution is preferable.
'ru)ru, pil・is 8, however, it is 1. Tsuzasig yells at Tafu, p! (If it is larger than 10, it is not preferable because it may damage the image area.

The etching process is performed on the substrate that has undergone the development process.
・Saw method of immersing the substrate in the cutting liquid, and applying the cutting liquid to the substrate.

You can do this with a shower-like flow of F, or with a 1-no blow.

After the etching process, the photocured coating film of circuit pattern 10 is
~1('')% of caustic soda, caustic, etc.
By dissolving and removing the substrate with an aqueous aqueous solution, a Brilliant circuit is first formed on the substrate.

(Example) I would like to share the present invention with 2 people: 4
Partially explained 4. Parts and U% in the examples.

Whitening example 1 Methyl methacrylate L/)2! ' 5 parts, rl-, 5 parts of acrylic acid, 70 parts of acrylic acid, and azo;, : ゛ Suisobuty D, , : 1 A mixture of 1, consisting of 3 parts of tolyl, was heated to τ, ゛, in a nitrogen gas atmosphere. 1.10”
It took 3 hours and 1 hour to extract the remaining 90 parts of CI.

After dropping F, aged for 1 hour, add 1 part of azodimethylbale O-glue and 5 K11 of pyrene glycol.
A mixed solution consisting of 10 parts of trimethylnidium was added dropwise to IB for 1 hour and then aged for 5 hours to obtain a high acid value acrylic resin solution (acid value 530). Next, 1-100 parts of glycidyl methacrylate, 08 parts of Hydro-A nonmonomegglutinated 7-terpa), and 0.6 parts of Te[Lagotylammonium bromide were added to this solution, and the mixture was heated at 110°C for 50 minutes while blowing air. Polymerizable unsaturated resin (acid value 73, unsaturation equivalent approximately 285, number average molecular weight 15)
,000,7g (12°C) solution was obtained.

Synthesis Examples 2 to 7 Performed in the same manner as in Synthesis Example 1, except that the monomer composition in the high acid value acrylic resin and the amount of chrycidyl methacrylate were changed. The acid value number average molecular weight was also the same as in Synthesis Example 1, and the unsaturation equivalent and Tg were changed. Table 1 shows the monomer composition, unsaturation equivalent, and Tg.

Table 1 Production Example 1 After neutralizing 300 parts of the resin solution of Synthesis Example 1 with 06 equivalents of triethylamine, Irgacure 9 was added as a photopolymerization initiator.
A solution prepared by dissolving 10 parts of 07 (manufactured by Ciba Geigy) in 10 parts of propylene glycol monomethyl ether was added, and then water was added so that the solid content was 15% to make an electrodeposition coating bath (pH 7.0). .

Production Example 2 0.6 equivalent of thylamine was neutralized. Next, a solution of 10 parts of Irgacure 907 dissolved in 10 parts of propylene glycol monomethyl ether as a photopolymerization initiator was added, and then water was added so that the solid content was 15% to form an AT coating bath (pH 7.0). .

Production Example 3 Using the resin solution of Synthesis Example 2, an electrodeposition coating bath (pH 7.0) was prepared in the same manner as in Production Example 1.

Production Example 4 Using the resin solution of Synthesis Example 3, an electrodeposition coating bath (pH 6, 9) was prepared in the same manner as in Production Example 1.

Production Example 5 Using the resin solution of Synthesis Example 4, an electrodeposition coating bath (pH 7.0) was prepared in the same manner as in Production Example 1.

Production Example 6 Using the resin solution of Synthesis Example 5, an electrodeposition coating bath (p) 17.0) was prepared in the same manner as in Production Example 1.

Production Example 7 The resin solution of Synthesis Example 6 was used to prepare an electrodeposition coating bath (pi(6,9)) in the same manner as in Production Example 1.

Production Example 8 The resin solution of Synthesis Example 7 was used to prepare an electrodeposition coating bath (pH 7.0) in the same manner as in Production Example 1.

Example 1 Using the electrodeposition coating bath of Production Example 1, a copper-clad laminate for printed wiring (100 x 150 x 1.6 mm) was used as an anode,
The copper-clad laminate was electrocoated by applying a direct current of 50 mA/d for 3 minutes at a bath temperature of 25°C. The maximum value of aS is 80 V, -8. Wash this coating film with water and air dry;
And 2OFFl]! A gentle feeling, light film 4 and l knee. ``Because of this, it eliminates surface adhesion and 4: 9% part) U・
Is it a polygon cable? No. 1. ．． ．． ．． ．． :il-no1 (ffi #l output approx. 1°00 ('1) aqueous solution (,
"1. F5 crush for 0 seconds 71 steps (dry. This cover~"
The film thickness of ・～l・ is about 1 unit (l) ”::) I(:,
r, Next, the chamber 3 items 22 "(,]] ζ, 'Oganoino 1 are brought into close contact with the coating plate of the vacuum chamber equipment - te', N+: A-131 ultra-high pressure mercury fire] are Jtl ζ' both sides. Ultraviolet rays (hereinafter referred to as
25°C, 1% after irradiation
Developed with an aqueous solution of carbonic acid and 1 ml of carbonic acid.
-;, 1iH8,7 culture 1. -n1゛-;-um・
Add ammonia aqueous solution to a 11-force 2 kg/cm" subl/- for copper etching, and then rinse with water for 50' (-, 3% caustic acid aqueous solution. After removing the cured film, a printed wiring board was obtained.

The test results W for the actual electrodeposition are shown in Tables 1 and 2.
(Same as above).

Example 2 Production example 2. Electrodeposition coating 1: Using a bath, the same horn method as in Example] was used to coat the cover: j~1.
2] P71!1 Surface a] A plain photoresist film with no adhesiveness was obtained. Next, Example 1 is the same! 1.
1 'V irradiation, development, jr゛・g, peeling f'E''
',';)mosquito,.

Example:; Electrodeposition coating of Production Example 3! I! , ) using a bath, example 1 no.
Same No. 5 Method 1 - Electrodeposition coating, cover 31 Doo 1, 2 and 2
1. A T4 smooth photoresist film with a pyn thickness and no surface adhesive thorns was obtained. Next (, ° Implementation, Example 1 and '11th)-1゛Method Ti''
1. JV irradiation, development, - 3 hoods.

Example 4 Using the electrodeposition coating bath of Production Example 4, and the same method 7, electrodeposition coating, covernide ~ 1 until 21 pm.
Thick surface without stickiness +2. A scrappy photoresist film was obtained. New number 4
'', IJv irradiation and development 11 times with the same strength as Example 1:
r 2.・G, I had 7j peeling.

Example E) Using the electrodeposition coating bath of Production Example 5, the electrodeposition coating was carried out using the same horn method as in Example 1.
A photoresist film with a thickness of I and a smooth surface of T' without tackiness was obtained. Next(·
UV irradiation and development using the same horn method as in Example J, -: r-j
：／Wing, it's been a long time since I left.

Example 6 Using the electrodeposition coating bath of Production Example 6, Example 12: fi-
Step 11 Electrodeposition coating, cover 1 to 5 and 21
Obtained a smooth photosensitive IIQ with no surface tackiness of p'm thickness;
r=Next, UV irradiation and development with the same droplets as in Example 1;

Comparative Example 1 Using the electrodeposition coating bath of Production Example 1, electrodeposition coating and cover coating were applied in the same manner as in Example 1 to form a smooth photoresist film with a thickness of 21F and no surface tack. Obtained!...Next, in the same manner as in Example J, L■■ irradiation, development, ]7 plucking, and peeling were performed.

Comparative Example 2 Using the electrostatic storage coating bath of Production Example 8, 1! in the same manner as Example 11'! A smooth photoresist film with no surface tackiness of 21F* was obtained using E1m coating and CoverCo-1. Next, IV irradiation side development, etching and peeling were carried out in the same manner as in Example 1.

Claims (4)

[Claims] 1. After electrodepositing a photocurable anionic electrodeposition paint on a copper-clad laminate, the coating film exposed to light through a negative film is developed with a weak alkaline solution, and then the exposed copper is etched with an alkaline etching solution. 1. A method for producing a printed wiring board, which comprises removing the remaining coating film using a strong alkaline solution, and then removing the remaining coating film using a strong alkaline solution to obtain a printed wiring board. 2. As a vehicle in a photocurable anionic electrodeposition paint, an unsaturated equivalent of 4 is obtained by adding a compound having a polymerizable unsaturated bond and a glycidyl group in the molecule to a high acid value acrylic resin.
00 or less, an acid value of 20 to 300, and a glass transition concentration of 15°C or less, the main component is a water-soluble or water-dispersible polymerizable unsaturated resin. Method. 3. After electrodepositing a photocurable anionic electrodeposition paint on a copper-clad laminate, a layer with a glass transition temperature of 20
3. A method for manufacturing a printed wiring board according to claim 1 or 2, characterized in that a water-soluble resin or water-dispersible resin coating is applied at a temperature of .degree. C. or higher. 4. After electrodepositing a photocurable anionic electrodeposition paint on a copper-clad laminate, a layer with a glass transition temperature of 20
3. A method for manufacturing a printed wiring board according to claim 1 or 2, characterized in that an anionic electrodeposition paint containing a water-soluble or water-dispersible resin as a main component at a temperature of 0.degree. C. or higher is electrodeposited.