JPH0468559U - - Google Patents
Info
- Publication number
- JPH0468559U JPH0468559U JP11233090U JP11233090U JPH0468559U JP H0468559 U JPH0468559 U JP H0468559U JP 11233090 U JP11233090 U JP 11233090U JP 11233090 U JP11233090 U JP 11233090U JP H0468559 U JPH0468559 U JP H0468559U
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating layer
- electronic components
- outer periphery
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の電子部品用リード線の一実施
例をの縦断側面図である。 １……心線、２……ニツケルめつき層、３……
パラジウムめつき層。
例をの縦断側面図である。 １……心線、２……ニツケルめつき層、３……
パラジウムめつき層。
Claims (1)
- 銅または銅合金よりなる心線の外周にニツケル
またはニツケル合金めつき層が設けられている電
子部品用リード線において、前記ニツケルまたは
ニツケル合金めつき層の外周にパラジウムめつき
層を設けてなることを特徴とする電子部品用リー
ド線。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233090U JPH0468559U (ja) | 1990-10-26 | 1990-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233090U JPH0468559U (ja) | 1990-10-26 | 1990-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468559U true JPH0468559U (ja) | 1992-06-17 |
Family
ID=31859833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11233090U Pending JPH0468559U (ja) | 1990-10-26 | 1990-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468559U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998010105A1 (fr) * | 1996-09-05 | 1998-03-12 | The Furukawa Electric Co., Ltd. | Alliage de cuivre pour dispositifs electroniques |
-
1990
- 1990-10-26 JP JP11233090U patent/JPH0468559U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998010105A1 (fr) * | 1996-09-05 | 1998-03-12 | The Furukawa Electric Co., Ltd. | Alliage de cuivre pour dispositifs electroniques |
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