JPH0468530U - - Google Patents

Info

Publication number
JPH0468530U
JPH0468530U JP11150790U JP11150790U JPH0468530U JP H0468530 U JPH0468530 U JP H0468530U JP 11150790 U JP11150790 U JP 11150790U JP 11150790 U JP11150790 U JP 11150790U JP H0468530 U JPH0468530 U JP H0468530U
Authority
JP
Japan
Prior art keywords
piece
lead frame
heat conductive
conductive plate
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11150790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11150790U priority Critical patent/JPH0468530U/ja
Publication of JPH0468530U publication Critical patent/JPH0468530U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP11150790U 1990-10-24 1990-10-24 Pending JPH0468530U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11150790U JPH0468530U (US20090163788A1-20090625-C00002.png) 1990-10-24 1990-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11150790U JPH0468530U (US20090163788A1-20090625-C00002.png) 1990-10-24 1990-10-24

Publications (1)

Publication Number Publication Date
JPH0468530U true JPH0468530U (US20090163788A1-20090625-C00002.png) 1992-06-17

Family

ID=31858969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11150790U Pending JPH0468530U (US20090163788A1-20090625-C00002.png) 1990-10-24 1990-10-24

Country Status (1)

Country Link
JP (1) JPH0468530U (US20090163788A1-20090625-C00002.png)

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