JPH0468529U - - Google Patents
Info
- Publication number
- JPH0468529U JPH0468529U JP11260890U JP11260890U JPH0468529U JP H0468529 U JPH0468529 U JP H0468529U JP 11260890 U JP11260890 U JP 11260890U JP 11260890 U JP11260890 U JP 11260890U JP H0468529 U JPH0468529 U JP H0468529U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plungers
- semiconductor
- sealing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11260890U JPH0468529U (en, 2012) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11260890U JPH0468529U (en, 2012) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468529U true JPH0468529U (en, 2012) | 1992-06-17 |
Family
ID=31860119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11260890U Pending JPH0468529U (en, 2012) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468529U (en, 2012) |
-
1990
- 1990-10-25 JP JP11260890U patent/JPH0468529U/ja active Pending