JPH0468528U - - Google Patents
Info
- Publication number
- JPH0468528U JPH0468528U JP11245890U JP11245890U JPH0468528U JP H0468528 U JPH0468528 U JP H0468528U JP 11245890 U JP11245890 U JP 11245890U JP 11245890 U JP11245890 U JP 11245890U JP H0468528 U JPH0468528 U JP H0468528U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- die
- region
- bonding
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11245890U JPH0468528U (US20030220297A1-20031127-C00033.png) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11245890U JPH0468528U (US20030220297A1-20031127-C00033.png) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468528U true JPH0468528U (US20030220297A1-20031127-C00033.png) | 1992-06-17 |
Family
ID=31859962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11245890U Pending JPH0468528U (US20030220297A1-20031127-C00033.png) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468528U (US20030220297A1-20031127-C00033.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659011A (zh) * | 2013-11-20 | 2015-05-27 | 西安永电电气有限责任公司 | 一种igbt模块的芯片焊接结构 |
| CN104900621A (zh) * | 2014-03-04 | 2015-09-09 | 西安永电电气有限责任公司 | 一种塑封式ipm的芯片焊接结构 |
-
1990
- 1990-10-25 JP JP11245890U patent/JPH0468528U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659011A (zh) * | 2013-11-20 | 2015-05-27 | 西安永电电气有限责任公司 | 一种igbt模块的芯片焊接结构 |
| CN104900621A (zh) * | 2014-03-04 | 2015-09-09 | 西安永电电气有限责任公司 | 一种塑封式ipm的芯片焊接结构 |
