JPH0468371U - - Google Patents
Info
- Publication number
- JPH0468371U JPH0468371U JP11218390U JP11218390U JPH0468371U JP H0468371 U JPH0468371 U JP H0468371U JP 11218390 U JP11218390 U JP 11218390U JP 11218390 U JP11218390 U JP 11218390U JP H0468371 U JPH0468371 U JP H0468371U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- terminal
- molded parts
- electronic device
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112183U JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990112183U JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0468371U true JPH0468371U (sk) | 1992-06-17 |
| JPH089896Y2 JPH089896Y2 (ja) | 1996-03-21 |
Family
ID=31859684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990112183U Expired - Lifetime JPH089896Y2 (ja) | 1990-10-25 | 1990-10-25 | 電子装置のモールド部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH089896Y2 (sk) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141473U (sk) * | 1979-03-29 | 1980-10-09 | ||
| JPS61256787A (ja) * | 1985-05-10 | 1986-11-14 | 株式会社日立製作所 | 回路基板の接続構造 |
-
1990
- 1990-10-25 JP JP1990112183U patent/JPH089896Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141473U (sk) * | 1979-03-29 | 1980-10-09 | ||
| JPS61256787A (ja) * | 1985-05-10 | 1986-11-14 | 株式会社日立製作所 | 回路基板の接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH089896Y2 (ja) | 1996-03-21 |