JPH0468329B2 - - Google Patents
Info
- Publication number
- JPH0468329B2 JPH0468329B2 JP60070799A JP7079985A JPH0468329B2 JP H0468329 B2 JPH0468329 B2 JP H0468329B2 JP 60070799 A JP60070799 A JP 60070799A JP 7079985 A JP7079985 A JP 7079985A JP H0468329 B2 JPH0468329 B2 JP H0468329B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- weight
- epoxy
- resin
- type phenolic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60070799A JPS61231023A (ja) | 1985-04-05 | 1985-04-05 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60070799A JPS61231023A (ja) | 1985-04-05 | 1985-04-05 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61231023A JPS61231023A (ja) | 1986-10-15 |
| JPH0468329B2 true JPH0468329B2 (enExample) | 1992-11-02 |
Family
ID=13441950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60070799A Granted JPS61231023A (ja) | 1985-04-05 | 1985-04-05 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61231023A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359062B1 (en) * | 1999-03-02 | 2002-03-19 | The Valspar Corporation | Coating compositions |
| EP3313913B1 (en) * | 2015-06-25 | 2020-12-30 | Dow Global Technologies LLC | Novel epoxy resin system for making carbon fiber composites |
-
1985
- 1985-04-05 JP JP60070799A patent/JPS61231023A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61231023A (ja) | 1986-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0513185B2 (enExample) | ||
| JPH0468329B2 (enExample) | ||
| JPS6222823A (ja) | 封止用樹脂組成物 | |
| JPH0249329B2 (enExample) | ||
| JP2641183B2 (ja) | 封止用樹脂組成物 | |
| JPH0548770B2 (enExample) | ||
| JPH03205443A (ja) | 封止用樹脂組成物及び半導体封止装置 | |
| JPS60161423A (ja) | 封止用樹脂組成物 | |
| JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS6143621A (ja) | 封止用樹脂組成物 | |
| JPH02245055A (ja) | 封止用樹脂組成物 | |
| JPH0621152B2 (ja) | 封止用樹脂組成物 | |
| JPH0562612B2 (enExample) | ||
| JPS60152522A (ja) | 封止用樹脂組成物 | |
| JPH1112446A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH11166103A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH11130943A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP3298084B2 (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH0314050B2 (enExample) | ||
| JPS6333416A (ja) | 封止用樹脂組成物 | |
| JPS62176151A (ja) | 樹脂封止型半導体装置 | |
| JPH0552846B2 (enExample) | ||
| JPH0414710B2 (enExample) | ||
| JPH11181240A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH1112437A (ja) | 封止用樹脂組成物および半導体封止装置 |