JPH0467352U - - Google Patents
Info
- Publication number
- JPH0467352U JPH0467352U JP1990109713U JP10971390U JPH0467352U JP H0467352 U JPH0467352 U JP H0467352U JP 1990109713 U JP1990109713 U JP 1990109713U JP 10971390 U JP10971390 U JP 10971390U JP H0467352 U JPH0467352 U JP H0467352U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- semiconductor
- hermetically sealed
- sealed package
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims 5
- 239000000919 ceramic Substances 0.000 claims 2
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990109713U JPH0638432Y2 (ja) | 1990-10-22 | 1990-10-22 | 半導体気密封止パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990109713U JPH0638432Y2 (ja) | 1990-10-22 | 1990-10-22 | 半導体気密封止パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0467352U true JPH0467352U (US20100223739A1-20100909-C00025.png) | 1992-06-15 |
JPH0638432Y2 JPH0638432Y2 (ja) | 1994-10-05 |
Family
ID=31856953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990109713U Expired - Lifetime JPH0638432Y2 (ja) | 1990-10-22 | 1990-10-22 | 半導体気密封止パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0638432Y2 (US20100223739A1-20100909-C00025.png) |
-
1990
- 1990-10-22 JP JP1990109713U patent/JPH0638432Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0638432Y2 (ja) | 1994-10-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |