JPH0467347U - - Google Patents
Info
- Publication number
- JPH0467347U JPH0467347U JP11087190U JP11087190U JPH0467347U JP H0467347 U JPH0467347 U JP H0467347U JP 11087190 U JP11087190 U JP 11087190U JP 11087190 U JP11087190 U JP 11087190U JP H0467347 U JPH0467347 U JP H0467347U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- electronic component
- hole provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087190U JPH0467347U (de) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087190U JPH0467347U (de) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467347U true JPH0467347U (de) | 1992-06-15 |
Family
ID=31858273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11087190U Pending JPH0467347U (de) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467347U (de) |
-
1990
- 1990-10-23 JP JP11087190U patent/JPH0467347U/ja active Pending