JPH0467335U - - Google Patents
Info
- Publication number
- JPH0467335U JPH0467335U JP11022290U JP11022290U JPH0467335U JP H0467335 U JPH0467335 U JP H0467335U JP 11022290 U JP11022290 U JP 11022290U JP 11022290 U JP11022290 U JP 11022290U JP H0467335 U JPH0467335 U JP H0467335U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- frame
- holding
- recess
- pressing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022290U JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022290U JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0467335U true JPH0467335U (US07652168-20100126-C00068.png) | 1992-06-15 |
| JPH0810190Y2 JPH0810190Y2 (ja) | 1996-03-27 |
Family
ID=31857529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11022290U Expired - Fee Related JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810190Y2 (US07652168-20100126-C00068.png) |
-
1990
- 1990-10-23 JP JP11022290U patent/JPH0810190Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810190Y2 (ja) | 1996-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |