JPH0465490U - - Google Patents
Info
- Publication number
- JPH0465490U JPH0465490U JP10832090U JP10832090U JPH0465490U JP H0465490 U JPH0465490 U JP H0465490U JP 10832090 U JP10832090 U JP 10832090U JP 10832090 U JP10832090 U JP 10832090U JP H0465490 U JPH0465490 U JP H0465490U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- heat sink
- wiring board
- groove
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10832090U JPH0465490U (uk) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10832090U JPH0465490U (uk) | 1990-10-15 | 1990-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0465490U true JPH0465490U (uk) | 1992-06-08 |
Family
ID=31855261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10832090U Pending JPH0465490U (uk) | 1990-10-15 | 1990-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0465490U (uk) |
-
1990
- 1990-10-15 JP JP10832090U patent/JPH0465490U/ja active Pending