JPH0465457U - - Google Patents
Info
- Publication number
- JPH0465457U JPH0465457U JP10826790U JP10826790U JPH0465457U JP H0465457 U JPH0465457 U JP H0465457U JP 10826790 U JP10826790 U JP 10826790U JP 10826790 U JP10826790 U JP 10826790U JP H0465457 U JPH0465457 U JP H0465457U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- crimp
- metal post
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826790U JPH0465457U (da) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826790U JPH0465457U (da) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465457U true JPH0465457U (da) | 1992-06-08 |
Family
ID=31855173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10826790U Pending JPH0465457U (da) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465457U (da) |
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1990
- 1990-10-15 JP JP10826790U patent/JPH0465457U/ja active Pending