JPH0465452U - - Google Patents

Info

Publication number
JPH0465452U
JPH0465452U JP10832990U JP10832990U JPH0465452U JP H0465452 U JPH0465452 U JP H0465452U JP 10832990 U JP10832990 U JP 10832990U JP 10832990 U JP10832990 U JP 10832990U JP H0465452 U JPH0465452 U JP H0465452U
Authority
JP
Japan
Prior art keywords
semiconductor element
terminal
electrodes formed
plate
extension part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10832990U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10832990U priority Critical patent/JPH0465452U/ja
Publication of JPH0465452U publication Critical patent/JPH0465452U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP10832990U 1990-10-15 1990-10-15 Pending JPH0465452U (US06312121-20011106-C00033.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10832990U JPH0465452U (US06312121-20011106-C00033.png) 1990-10-15 1990-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10832990U JPH0465452U (US06312121-20011106-C00033.png) 1990-10-15 1990-10-15

Publications (1)

Publication Number Publication Date
JPH0465452U true JPH0465452U (US06312121-20011106-C00033.png) 1992-06-08

Family

ID=31855278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10832990U Pending JPH0465452U (US06312121-20011106-C00033.png) 1990-10-15 1990-10-15

Country Status (1)

Country Link
JP (1) JPH0465452U (US06312121-20011106-C00033.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217349A (ja) * 2001-01-17 2002-08-02 Rohm Co Ltd 半導体装置の製造方法および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217349A (ja) * 2001-01-17 2002-08-02 Rohm Co Ltd 半導体装置の製造方法および半導体装置
JP4494654B2 (ja) * 2001-01-17 2010-06-30 ローム株式会社 半導体装置の製造方法および半導体装置

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