JPH0464619B2 - - Google Patents
Info
- Publication number
- JPH0464619B2 JPH0464619B2 JP60298521A JP29852185A JPH0464619B2 JP H0464619 B2 JPH0464619 B2 JP H0464619B2 JP 60298521 A JP60298521 A JP 60298521A JP 29852185 A JP29852185 A JP 29852185A JP H0464619 B2 JPH0464619 B2 JP H0464619B2
- Authority
- JP
- Japan
- Prior art keywords
- polyarylene sulfide
- sulfide resin
- salt
- resin
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 229920000412 polyarylene Polymers 0.000 claims description 51
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 42
- 150000003839 salts Chemical class 0.000 claims description 30
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 25
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 25
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 21
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 20
- 239000002798 polar solvent Substances 0.000 claims description 8
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 235000002639 sodium chloride Nutrition 0.000 description 43
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 18
- -1 table salt remains Chemical class 0.000 description 13
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 229910052783 alkali metal Inorganic materials 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000011780 sodium chloride Substances 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 229910001508 alkali metal halide Inorganic materials 0.000 description 5
- 150000008045 alkali metal halides Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910052977 alkali metal sulfide Inorganic materials 0.000 description 3
- 238000005119 centrifugation Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 238000010561 standard procedure Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BCNBMSZKALBQEF-UHFFFAOYSA-N 1,3-dimethylpyrrolidin-2-one Chemical compound CC1CCN(C)C1=O BCNBMSZKALBQEF-UHFFFAOYSA-N 0.000 description 2
- GWCFTYITFDWLAY-UHFFFAOYSA-N 1-ethylazepan-2-one Chemical compound CCN1CCCCCC1=O GWCFTYITFDWLAY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- XIXADJRWDQXREU-UHFFFAOYSA-M lithium acetate Chemical compound [Li+].CC([O-])=O XIXADJRWDQXREU-UHFFFAOYSA-M 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- JAAGVIUFBAHDMA-UHFFFAOYSA-M rubidium bromide Chemical compound [Br-].[Rb+] JAAGVIUFBAHDMA-UHFFFAOYSA-M 0.000 description 2
- FGDZQCVHDSGLHJ-UHFFFAOYSA-M rubidium chloride Chemical compound [Cl-].[Rb+] FGDZQCVHDSGLHJ-UHFFFAOYSA-M 0.000 description 2
- AHLATJUETSFVIM-UHFFFAOYSA-M rubidium fluoride Chemical compound [F-].[Rb+] AHLATJUETSFVIM-UHFFFAOYSA-M 0.000 description 2
- WFUBYPSJBBQSOU-UHFFFAOYSA-M rubidium iodide Chemical compound [Rb+].[I-] WFUBYPSJBBQSOU-UHFFFAOYSA-M 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- BSJWDQYZFBYNIM-UHFFFAOYSA-N 1,3,4,5-tetramethylpyrrolidin-2-one Chemical compound CC1C(C)N(C)C(=O)C1C BSJWDQYZFBYNIM-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- NCNWTBAWLAFYDR-UHFFFAOYSA-N 1,6-dimethylpiperidin-2-one Chemical compound CC1CCCC(=O)N1C NCNWTBAWLAFYDR-UHFFFAOYSA-N 0.000 description 1
- SZMLDVKZMIXAJF-UHFFFAOYSA-N 1-(2-methylpropyl)azepan-2-one Chemical compound CC(C)CN1CCCCCC1=O SZMLDVKZMIXAJF-UHFFFAOYSA-N 0.000 description 1
- IOOXDDQLNSTLNL-UHFFFAOYSA-N 1-(2-methylpropyl)piperidin-2-one Chemical compound CC(C)CN1CCCCC1=O IOOXDDQLNSTLNL-UHFFFAOYSA-N 0.000 description 1
- IVUYGANTXQVDDG-UHFFFAOYSA-N 1-(2-methylpropyl)pyrrolidin-2-one Chemical compound CC(C)CN1CCCC1=O IVUYGANTXQVDDG-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- VGZOTUWVGXUNRC-UHFFFAOYSA-N 1-butylazepan-2-one Chemical compound CCCCN1CCCCCC1=O VGZOTUWVGXUNRC-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- MXEOFTCIEDUHCX-UHFFFAOYSA-N 1-cyclohexylazepan-2-one Chemical compound O=C1CCCCCN1C1CCCCC1 MXEOFTCIEDUHCX-UHFFFAOYSA-N 0.000 description 1
- VUQMOERHEHTWPE-UHFFFAOYSA-N 1-ethylpiperidin-2-one Chemical compound CCN1CCCCC1=O VUQMOERHEHTWPE-UHFFFAOYSA-N 0.000 description 1
- GGYVTHJIUNGKFZ-UHFFFAOYSA-N 1-methylpiperidin-2-one Chemical compound CN1CCCCC1=O GGYVTHJIUNGKFZ-UHFFFAOYSA-N 0.000 description 1
- NDDIKKNFARRUNI-UHFFFAOYSA-N 1-phosphorosopropane Chemical compound CCCP=O NDDIKKNFARRUNI-UHFFFAOYSA-N 0.000 description 1
- GVDQKJQFVPXADH-UHFFFAOYSA-N 1-propan-2-ylpiperidin-2-one Chemical compound CC(C)N1CCCCC1=O GVDQKJQFVPXADH-UHFFFAOYSA-N 0.000 description 1
- GHELJWBGTIKZQW-UHFFFAOYSA-N 1-propan-2-ylpyrrolidin-2-one Chemical compound CC(C)N1CCCC1=O GHELJWBGTIKZQW-UHFFFAOYSA-N 0.000 description 1
- BWISIXSYQURMMY-UHFFFAOYSA-N 1-propylazepan-2-one Chemical compound CCCN1CCCCCC1=O BWISIXSYQURMMY-UHFFFAOYSA-N 0.000 description 1
- DCALJVULAGICIX-UHFFFAOYSA-N 1-propylpyrrolidin-2-one Chemical compound CCCN1CCCC1=O DCALJVULAGICIX-UHFFFAOYSA-N 0.000 description 1
- WBNUVPGJLHTDTD-UHFFFAOYSA-N 4-ethyl-5-methylimidazolidin-2-one Chemical compound CCC1NC(=O)NC1C WBNUVPGJLHTDTD-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229920013632 Ryton Polymers 0.000 description 1
- 239000004736 Ryton® Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- ZOAIGCHJWKDIPJ-UHFFFAOYSA-M caesium acetate Chemical compound [Cs+].CC([O-])=O ZOAIGCHJWKDIPJ-UHFFFAOYSA-M 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 description 1
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940031993 lithium benzoate Drugs 0.000 description 1
- LDJNSLOKTFFLSL-UHFFFAOYSA-M lithium;benzoate Chemical compound [Li+].[O-]C(=O)C1=CC=CC=C1 LDJNSLOKTFFLSL-UHFFFAOYSA-M 0.000 description 1
- AXMOZGKEVIBBCF-UHFFFAOYSA-M lithium;propanoate Chemical compound [Li+].CCC([O-])=O AXMOZGKEVIBBCF-UHFFFAOYSA-M 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- IMNDHOCGZLYMRO-UHFFFAOYSA-N n,n-dimethylbenzamide Chemical compound CN(C)C(=O)C1=CC=CC=C1 IMNDHOCGZLYMRO-UHFFFAOYSA-N 0.000 description 1
- IFTIBNDWGNYRLS-UHFFFAOYSA-N n,n-dipropylacetamide Chemical compound CCCN(C(C)=O)CCC IFTIBNDWGNYRLS-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- SXCQOWSCNMKTFA-UHFFFAOYSA-N phosphorosobenzene Chemical compound O=PC1=CC=CC=C1 SXCQOWSCNMKTFA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229940102127 rubidium chloride Drugs 0.000 description 1
- FOGKDYADEBOSPL-UHFFFAOYSA-M rubidium(1+);acetate Chemical compound [Rb+].CC([O-])=O FOGKDYADEBOSPL-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- SRRKNRDXURUMPP-UHFFFAOYSA-N sodium disulfide Chemical compound [Na+].[Na+].[S-][S-] SRRKNRDXURUMPP-UHFFFAOYSA-N 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
Description
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[Industrial Field of Application] The present invention relates to a method for purifying polyarylene sulfide resin, and more specifically, the present invention relates to a method for purifying polyarylene sulfide resin, and more specifically, from a polyarylene sulfide resin containing salt, to polyarylene sulfide resin having a significantly low salt content. The present invention relates to a novel and useful method for purifying polyarylene sulfide resins, by which polyarylene sulfide resins can be easily obtained. This invention is utilized in the field of purification of polyarylene sulfide resins such as polyphenylene sulfide resins containing salts. Polyarylene sulfide resins such as polyphenylene sulfide resins with a low salt content obtained by the method of the present invention can be used as materials with high heat resistance and high strength, for example in electrical and electrical applications.
Can be used in electronic fields, etc. [Prior art and its problems] Polyarylene sulfide resins such as polyphenylene sulfide resins are thermoplastic resins that partially have thermosetting properties, and have excellent chemical resistance and good stability over a wide temperature range. It has excellent properties as an engineering plastic, such as mechanical properties and heat-resistant rigidity. Polyarylene sulfide resins such as polyphenylene sulfide resins are usually obtained by polymerizing a dihalogen aromatic compound and an alkali metal sulfide in a polar solvent. for example,
The production of polyphenylene sulfide resin is usually p
-It is carried out by polymerizing dichlorobenzene and sodium disulfide in a polar solvent (Japanese Patent Publication No. 12240/1989, etc.), but salts such as common salt produced by the polymerization reaction are usually contained in the resin. 1000ïœ
Approximately 3000ppm remains. If salt such as table salt remains, when polyarylene sulfide resin such as polyphenylene sulfide resin is applied to the electrical and electronic fields, the moisture-resistant insulation of the circuit will decrease and cause malfunction. The resin needs to be purified again to remove the salts. Conventionally, a method of carrying out a polymerization reaction in the presence of polyoxyethylene ether has been proposed as a method for producing polyphenylene sulfide resin with a low salt content such as common salt (Japanese Patent Application Laid-open No. 74127/1983).
There is a problem in that the polyoxyethylene ether needs to be removed after the polymerization reaction is completed, which is not practical. On the other hand, as a method for purifying polyphenylene sulfide resin, a method has been proposed in which heat treatment is performed at a high temperature of 238°C using sodium carbonate or the like in an aqueous slurry (Japanese Patent Application Laid-open No. 108136/1982).
There is a problem that the removal efficiency of salt is low. In addition, a purification method in which polyphenylene sulfide resin is brought into contact with a mixed solvent of a polar aprotic solvent and ethylene glycol has been proposed (Japanese Patent Application Laid-open No. 108135/1983), but the development of a more useful method is desired. was. [Object of the Invention] This invention has been made based on the above circumstances. That is, an object of the present invention is to solve the above-mentioned problems and to produce a polyarylene sulfide such as a polyphenylene sulfide resin in which the salt content is significantly reduced from a polyarylene sulfide such as a polyphenylene sulfide resin containing a salt. It is an object of the present invention to provide a new and useful method for purifying polyarylene sulfide resin, which makes it possible to easily obtain arylene sulfide resin. [Means for solving the above problems] The outline of the present invention for solving the above problems is to provide a method for purifying a salt-containing polyarylene sulfide resin. A method for purifying a polyarylene sulfide resin, which comprises contacting the polyarylene sulfide resin with a polar solvent and polyvinyl alcohol. The polyarylene sulfide resin containing the salt in the present invention is a polyarylene sulfide resin containing an alkali metal salt. Examples of the alkali metal salts include alkali metal halides, alkali metal carboxylates, and alkali metal sulfonates. Among these, alkali metal halides can be efficiently desalted from polyarylene sulfide resins by the method of the present invention. Specific examples of the alkali metal halides include:
Lithium fluoride, sodium fluoride, lithium chloride, potassium fluoride, rubidium fluoride, cesium fluoride, sodium chloride, potassium chloride, rubidium chloride, cesium chloride, sodium bromide, potassium bromide, rubidium bromide, cesium bromide , lithium iodide, sodium iodide, rubidium iodide, cesium iodide, etc.
Among them, lithium chloride, sodium chloride, and even sodium chloride often appear as substances to be desalted in the production of polyarylene sulfide resins, and are advantageously desalted by the method of the present invention. Examples of the alkali metal carboxylates mentioned above include compounds such as lithium acetate, sodium acetate, potassium acetate, rubidium acetate, cesium acetate, lithium propionate, lithium benzoate, etc. Among them, lithium acetate is used for polyarylene It often appears as something to be desalted in the production of sulfide resins and is conveniently removed by the process of this invention. Examples of the alkali metal sulfonate include sodium benzenesulfonate. The polyarylene sulfide resin to which the present invention is applied usually has a concentration of 500
Examples include those containing alkali metal salts in a content of ~5000 ppm, preferably 1000 to 3000 ppm. The polyarylene sulfide resin containing the above-mentioned salt in the present invention may contain one or more of the above-mentioned alkali metal salts as the alkali metal salt. The polyarylene sulfide resin related to the salt-containing polyarylene sulfide in the present invention is characterized in that the structure of the polymer forming the resin or the structure of the main part of the polymer is such that the sulfur atom and the carbon of the aromatic ring are It has a structure in which atoms are repeatedly bonded alternately. The structure of the polymer constituting the resin or the main part of the polymer is usually the following (formula a): (Here, S represents a sulfur atom. R 1 , R 2 ,
R 3 and R 4 are hydrogen, C 1 to C 20 alkyl group, C 5 to
represents a C20 cycloalkyl group, a C6 - C24 aryl group, a C7 - C24 alkaryl group or a C7 - C24 aralkyl group, and R1 , R2 , R3 , R4 is 2
may combine to form an aromatic ring or a heterocyclic ring, and -S-, -O-,
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ãã[Formula] A branched structure may be formed by bonding to other polyarylene sulfide units.
n is usually an integer in the range of 1 to 1000, preferably 3 to 600. ) can be expressed as Among these resins, polyphenylene sulfide resins are preferred because they can effectively exhibit the effects of the present invention. The polyarylene sulfide resin containing the salt of the present invention is produced when a dihalogen aromatic compound and an alkali metal sulfide are reacted in a polar solvent in the presence or absence of various additives. . After the reaction is complete, the polyarylene sulfide can be separated directly from the reaction solution by standard methods, e.g. by filtration or centrifugation, or
For example, it can be obtained by adding water and/or diluted acid and then fractionating it from the reaction solution. Following the filtration step, the polymer is generally recovered by washing, such as with water, to remove any inorganic components that may adhere to the polymer, such as alkali metal sulfides and alkali metal halides. In this way, the recovered polyarylene sulfide resin usually contains 500 to 5000 ppm of alkali metal salts such as alkali metal halides even after washing with water, washing, and extraction as described above. . For example, the polyphenylene sulfide resin is produced by reacting p-chlorobenzene and sodium sulfide in the solvent, but sodium ions are present in the produced resin.
It is known that about 1000 to 3000 ppm remains. The polyarylene sulfide resin containing the salt used in the present invention may be produced not only by the above-mentioned production method but also by any other method. .
In other words, whether it is a commercial product or a sample product,
It may be newly manufactured. For example, polyarylene sulfide resins containing the above-mentioned salts are manufactured by Phillips Corporation in the United States and are commercially available. The polyvinyl alcohol in the present invention is
It is an ordinary polyvinyl alcohol whose main chain structure or main part structure of the polymer can be represented by repeating [ -CH2CH (OH)]- units. In the method of the present invention, polyvinyl alcohols having a degree of polymerization generally in the range of 30 to 5,000, particularly 200 to 2,000 are preferably used. If the degree of polymerization of the polyvinyl alcohol is less than 30, the removal rate of salts in the polyarylene sulfide resin may be low; if it is greater than 5000,
Polyvinyl alcohol may remain in the resin. The polyvinyl alcohol may be produced by any method; for example, a commercially available product may be used as is. Below, a method for purifying polyarylene sulfide containing the above-mentioned salt of the present invention will be explained. Polyarylene sulfide resin containing the above salt [hereinafter sometimes referred to as component (A)]. ] and the polyvinyl alcohol [hereinafter sometimes referred to as component (B). ] and a polar solvent [hereinafter sometimes referred to as component (C). ] and contact each other [here, contact means mixing, dissolving, dispersing, etc.]
let The temperature in this case is not particularly limited, but
This is usually done under heating at 100 to 250°C. After this contact heat treatment, it is cooled to room temperature to 80°C, and the solvent and the like are removed by a conventional separation method such as filtration or centrifugation, and the polyarylene sulfide resin is recovered. This recovered resin can be washed by a standard washing process such as washing with water, washing with other solvents, extraction process, etc., but in the method of the present invention, The resin can be further effectively washed and purified by washing with hot water. The polyarylene sulfide resin washed and purified by this hot water washing treatment is separated and recovered as a solid by a conventional separation method such as filtration or centrifugation. The recovered resin is dried by standard methods commonly used to obtain purified polyarylene sulfide. The salt content in the purified polyarylene sulfide obtained by such a method is
Typically, it can be significantly lower than 30 ppm. Note that the action of polyvinyl alcohol has not yet been clearly explained theoretically. Examples of the polar solvent used in the purification method of the present invention, that is, component C, include N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N,N-
Dipropylacetamide, N,N-dimethylbenzoic acid amide, caprolactam, N-methylcaprolactam, N-ethylcaprolactam N-isopropylcaprolactam, N-isobutylcaprolactam, N-propylcaprolactam, N-butylcaprolactam, N-cyclohexylcaprolactam , N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-isopropyl-2-
pyrrolidone, N-isobutyl-2-pyrrolidone,
N-propyl-2-pyrrolidone, N-butyl-2
-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-methyl-3-methyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-
Methyl-3-methyl-2-pyrrolidone, N-methyl-3,4,5-trimethyl-2-pyrrolidone,
N-methyl-2-piperidone, N-ethyl-2-
Piperidone, N-isopropyl-2-piperidone, N-isobutyl-2-piperidone, N-methyl-6-methyl-2-piperidone, N-methyl-
3-ethyl-2-piperodone, N-methyl-2-
Oxo-hexamethyleneimine, N-ethyl-2
-oxo-hexamethyleneimine, N-ethyl-
2-oxo-hexamethyleneimine, tetramethylurea, 1,3-dimethylethyleneurea, 1,3
-dimethylpropylene urea, 1-methyl-1-oxosulfolane, 1-ethyl-1-oxosulfolane, 1-phenyl-1-oxosulfolane, 1
-Methyl-1-oxosulfolane, 1-methyl-
Examples include 1-oxophosphane, 1-propyl-1-oxophosphane, 1-phenyl-1-oxophosphane, and the like. These solvents may be used alone or in combination of two or more. Further, among the various polar solvents mentioned above, N-alkyl lactams and N-alkylpyrrolidone are preferred, and N-methylpyrrolidone is particularly preferred.
These solvents may be used alone or in combination of two or more. The blending ratio of the components (A), (B), and (C) in the method of the present invention is as follows. That is, the (A) component/(B) component (weight ratio) is usually 1-100, preferably 2-10. This blending ratio
If it is larger than 100, the removal rate of salts in the polyarylene sulfide resin may not be sufficient;
On the other hand, if it is less than 1, it may become difficult to remove the polyvinyl alcohol or its decomposition products. In addition, the (A) component/(C) component (weight ratio) is usually
It is 0.01-0.5, preferably 0.02-0.3. If this blending ratio is larger than 0.5, the salt removal efficiency may decrease, while if it is smaller than 0.01, productivity may decrease. In the method of the present invention, when blending the components (A), (B), and (C), the order and method of adding and blending each component may be arbitrary. However, it is usually preferable to dissolve or disperse component (B) in component (C) and then mix it with component (A). Note that there is no particular restriction on the temperature at which the above-mentioned components are blended, but it generally suffices as long as it is at room temperature or above. In the present invention, the temperature of the contact heat treatment of the components (A), (B), and (C) is set to 150°C or higher, preferably
It can also be carried out at a temperature of 160°C or higher. This is because by setting the temperature of the heat treatment to 150° C. or higher, the polyvinyl alcohol used can be easily discharged from the system as a ketone, aldehyde, etc. If the temperature of the heat treatment is less than 150°C, the purification effect of the resin will be lowered, such as polyvinyl alcohol remaining in the resulting polyarylene sulfide resin, and a post-process such as hot water treatment will be required. The pressure during the contact heat treatment is not particularly limited, but is usually from the natural pressure of the heating system to 50 kg/cm 2 preferably,
The natural pressure of the system is about 3 kg/cm 2 . Heat treatment time is usually 10 minutes to 20 hours, preferably
30 minutes to 10 hours. As the contact heat treatment method, normal standard methods such as a batch method, a semi-batch method, and a continuous flow method can be used, but in order to increase the contact efficiency,
It is preferable to stir the system thoroughly. Also,
A method in which vapors of ketones, aldehydes, etc. produced by thermal decomposition of polyvinyl alcohol etc. are discharged from the system during the contact heat treatment can also be suitably used. At this time, it is preferable to carry out the reaction in an inert gas flow such as nitrogen gas. The hot water washing treatment is usually carried out at a temperature range of 60 to 200°C, preferably 80 to 130°C. When molding the polyarylene sulfide resin obtained by the method of this invention into various products,
Other polymers, pigments and fillers, such as graphite, metal powders, glass powders, quartz powders or glass fibers, carbon fibers, boron fibers, or additives commonly used for polyarylene sulfides, such as conventional stabilizers. It can be mixed with a mold release agent or mold release agent. Polyarylene sulfide resins such as polyphenylene sulfide resins obtained by the method of this invention have extremely low salt content such as common salt in the resin, so they have high moisture resistance and electrical insulation properties. Because it can be produced as a high molecular weight resin with low melt flow, it can be used as a matrix resin for various molded products and composite materials, and can also be made into various molded products, films, fibers, etc. It is an excellent engineering plastic that can be suitably used not only for mechanical parts but also for electrical and electronic parts. [Effects of the Invention] According to the present invention, a polyarylene sulfide resin containing salt such as common salt is purified, and a polyarylene sulfide resin having an extremely low salt content such as common salt or the like of 30 ppm or less is obtained. Fido resin can be easily obtained. The polyarylene sulfide resin purified by this method and having a low salt content can be suitably used in the electrical and electronic fields. [Examples] Next, Examples and Comparative Examples will be shown to further specifically explain the present invention. (Example 1) 500ml equipped with stirrer, cooler, and N2 inlet tube
Commercially available polyphenylene sulfide (PPS) (Ryton V-1 manufactured by Phillips,
200 g of N - methylpyrrolidone (NMP) in which 5 g of polyvinyl alcohol (PVA) (manufactured by Wako Pure Chemical Industries, Ltd., polymerization degree = 500) was dissolved. was dispersed and heated and stirred at 250 RPM for 4 hours at 200° C. in a N 2 stream. After the scheduled time, cool to room temperature and remove from NMP.
Filter the PPS and disperse it again in 200ml of ion-exchanged water.
Stirring at 100°C for 60 minutes was performed twice. The Na + content of the recovered PPS was measured by atomic absorption method and was found to be 20 ppm. (Comparative Example 1) The same procedure as in Example 1 was performed except that PVA was not used. Na + in the obtained PPS is
It was 640ppm. (Comparative Example 2) 20g of commercially available PPS used in Example 2 was added to ion-exchanged water.
The mixture was dispersed in 200 ml and washed by stirring at 150° C. for 4 hours in a N 2 stream. Na + in recovered PPS is 1350ppm
It was hot. (Example 2) The same procedure as in Example 1 was carried out except that 10 g of PVA with a degree of polymerization of 1500 and 1 kg of NMP were used. The Na + content in the recovered PPS was 17 ppm. (Example 3) The same procedure as in Example 1 was carried out except that 25 g of PVA and 1 kg of NMP were used. The Na + content in the recovered PPS was 8 ppm. (Example 4) The same procedure as in Example 1 was carried out except that the temperature was changed from 200°C to 170°C and 4 hours were changed to 2 hours. The Na + content in the recovered PPS was 28 ppm.
Claims (1)
ã®ç²Ÿè£œæ¹æ³ã«ãããŠãå¡©ãå«æããããªã¢ãªãŒã¬
ã³ã¹ã«ãã€ãæš¹èã極æ§æº¶åªããã³ããªããã«ã¢
ã«ã³ãŒã«ãšæ¥è§Šãããããšãç¹åŸŽãšããããªã¢ãª
ãŒã¬ã³ã¹ã«ãã€ãæš¹èã®ç²Ÿè£œæ¹æ³ã ïŒ åèšããªã¢ãªãŒã¬ã¹ã«ãã€ãæš¹èãããªããš
ãã¬ã³ã¹ã«ãã€ãæš¹èã§ããåèšç¹èš±è«æ±ã®ç¯å²
第ïŒé ã«èšèŒã®ããªã¢ãªãŒã¬ã³ã¹ã«ãã€ãæš¹èã®
粟補æ¹æ³ã ïŒ åèšããªããã«ã¢ã«ã³ãŒã«ããéå床200ã
2000ã®ããªããã«ã¢ã«ã³ãŒã«ã§ããåèšç¹èš±è«æ±
ã®ç¯å²ç¬¬ïŒé ããã³ç¬¬ïŒé ã®ããããã«èšèŒã®ã
ãªã¢ãªãŒã¬ã³ã¹ã«ãã€ãã®ç²Ÿè£œæ¹æ³ã[Claims] 1. A method for purifying a polyarylene sulfide resin containing a salt, which comprises bringing the polyarylene sulfide resin containing a salt into contact with a polar solvent and polyvinyl alcohol. Method for purifying id resin. 2. The method for purifying a polyarylene sulfide resin according to claim 1, wherein the polyarylene sulfide resin is a polyphenylene sulfide resin. 3 The polyvinyl alcohol has a degree of polymerization of 200 to
2,000 polyvinyl alcohol.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60298521A JPS62156134A (en) | 1985-12-28 | 1985-12-28 | Purification of polyarylene sulfide resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60298521A JPS62156134A (en) | 1985-12-28 | 1985-12-28 | Purification of polyarylene sulfide resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62156134A JPS62156134A (en) | 1987-07-11 |
JPH0464619B2 true JPH0464619B2 (en) | 1992-10-15 |
Family
ID=17860802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60298521A Granted JPS62156134A (en) | 1985-12-28 | 1985-12-28 | Purification of polyarylene sulfide resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62156134A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08157719A (en) * | 1994-12-09 | 1996-06-18 | Idemitsu Petrochem Co Ltd | Polyarylene sulfide resin composition |
Families Citing this family (1)
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CN103242529A (en) * | 2013-05-31 | 2013-08-14 | åžžçåžéæ³å纀ç»é æéèŽ£ä»»å ¬åž | Purifying refining method for high-molecular-weight polyphenylene sulfide |
-
1985
- 1985-12-28 JP JP60298521A patent/JPS62156134A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08157719A (en) * | 1994-12-09 | 1996-06-18 | Idemitsu Petrochem Co Ltd | Polyarylene sulfide resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS62156134A (en) | 1987-07-11 |
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