JPH0463674U - - Google Patents

Info

Publication number
JPH0463674U
JPH0463674U JP10770190U JP10770190U JPH0463674U JP H0463674 U JPH0463674 U JP H0463674U JP 10770190 U JP10770190 U JP 10770190U JP 10770190 U JP10770190 U JP 10770190U JP H0463674 U JPH0463674 U JP H0463674U
Authority
JP
Japan
Prior art keywords
soldering surface
layer
insulating
circuit board
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10770190U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0735411Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990107701U priority Critical patent/JPH0735411Y2/ja
Publication of JPH0463674U publication Critical patent/JPH0463674U/ja
Application granted granted Critical
Publication of JPH0735411Y2 publication Critical patent/JPH0735411Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1990107701U 1990-10-15 1990-10-15 回路基板 Expired - Lifetime JPH0735411Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990107701U JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107701U JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Publications (2)

Publication Number Publication Date
JPH0463674U true JPH0463674U (US20020095090A1-20020718-M00002.png) 1992-05-29
JPH0735411Y2 JPH0735411Y2 (ja) 1995-08-09

Family

ID=31854345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107701U Expired - Lifetime JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Country Status (1)

Country Link
JP (1) JPH0735411Y2 (US20020095090A1-20020718-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019096687A (ja) * 2017-11-21 2019-06-20 ファナック株式会社 樹脂成型基板及びコンデンサの実装構造

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645475U (US20020095090A1-20020718-M00002.png) * 1987-06-30 1989-01-12
JPS6447092A (en) * 1987-08-18 1989-02-21 Fujitsu Ltd Soldering method of surface packaging component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645475U (US20020095090A1-20020718-M00002.png) * 1987-06-30 1989-01-12
JPS6447092A (en) * 1987-08-18 1989-02-21 Fujitsu Ltd Soldering method of surface packaging component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019096687A (ja) * 2017-11-21 2019-06-20 ファナック株式会社 樹脂成型基板及びコンデンサの実装構造
US10984949B2 (en) 2017-11-21 2021-04-20 Fanuc Corporation Resin molded substrate and mounting structure for capacitor

Also Published As

Publication number Publication date
JPH0735411Y2 (ja) 1995-08-09

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