JPH0463674U - - Google Patents
Info
- Publication number
- JPH0463674U JPH0463674U JP10770190U JP10770190U JPH0463674U JP H0463674 U JPH0463674 U JP H0463674U JP 10770190 U JP10770190 U JP 10770190U JP 10770190 U JP10770190 U JP 10770190U JP H0463674 U JPH0463674 U JP H0463674U
- Authority
- JP
- Japan
- Prior art keywords
- soldering surface
- layer
- insulating
- circuit board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003973 paint Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107701U JPH0735411Y2 (ja) | 1990-10-15 | 1990-10-15 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107701U JPH0735411Y2 (ja) | 1990-10-15 | 1990-10-15 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463674U true JPH0463674U (US06818201-20041116-C00086.png) | 1992-05-29 |
| JPH0735411Y2 JPH0735411Y2 (ja) | 1995-08-09 |
Family
ID=31854345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990107701U Expired - Lifetime JPH0735411Y2 (ja) | 1990-10-15 | 1990-10-15 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735411Y2 (US06818201-20041116-C00086.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645475U (US06818201-20041116-C00086.png) * | 1987-06-30 | 1989-01-12 | ||
| JPS6447092A (en) * | 1987-08-18 | 1989-02-21 | Fujitsu Ltd | Soldering method of surface packaging component |
-
1990
- 1990-10-15 JP JP1990107701U patent/JPH0735411Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645475U (US06818201-20041116-C00086.png) * | 1987-06-30 | 1989-01-12 | ||
| JPS6447092A (en) * | 1987-08-18 | 1989-02-21 | Fujitsu Ltd | Soldering method of surface packaging component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
| US10984949B2 (en) | 2017-11-21 | 2021-04-20 | Fanuc Corporation | Resin molded substrate and mounting structure for capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735411Y2 (ja) | 1995-08-09 |
