JPH0463637U - - Google Patents
Info
- Publication number
- JPH0463637U JPH0463637U JP40308890U JP40308890U JPH0463637U JP H0463637 U JPH0463637 U JP H0463637U JP 40308890 U JP40308890 U JP 40308890U JP 40308890 U JP40308890 U JP 40308890U JP H0463637 U JPH0463637 U JP H0463637U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40308890U JPH0463637U (enExample) | 1990-01-10 | 1990-12-11 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP157490 | 1990-01-10 | ||
| JP40308890U JPH0463637U (enExample) | 1990-01-10 | 1990-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463637U true JPH0463637U (enExample) | 1992-05-29 |
Family
ID=31889734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40308890U Pending JPH0463637U (enExample) | 1990-01-10 | 1990-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463637U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025037453A1 (ja) * | 2023-08-16 | 2025-02-20 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
-
1990
- 1990-12-11 JP JP40308890U patent/JPH0463637U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025037453A1 (ja) * | 2023-08-16 | 2025-02-20 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
| JP2025027670A (ja) * | 2023-08-16 | 2025-02-28 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |