JPH0463636U - - Google Patents
Info
- Publication number
- JPH0463636U JPH0463636U JP10732390U JP10732390U JPH0463636U JP H0463636 U JPH0463636 U JP H0463636U JP 10732390 U JP10732390 U JP 10732390U JP 10732390 U JP10732390 U JP 10732390U JP H0463636 U JPH0463636 U JP H0463636U
- Authority
- JP
- Japan
- Prior art keywords
- container
- syringe
- silver paste
- float
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10732390U JPH0463636U (enrdf_load_stackoverflow) | 1990-10-12 | 1990-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10732390U JPH0463636U (enrdf_load_stackoverflow) | 1990-10-12 | 1990-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463636U true JPH0463636U (enrdf_load_stackoverflow) | 1992-05-29 |
Family
ID=31853780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10732390U Pending JPH0463636U (enrdf_load_stackoverflow) | 1990-10-12 | 1990-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463636U (enrdf_load_stackoverflow) |
-
1990
- 1990-10-12 JP JP10732390U patent/JPH0463636U/ja active Pending