JPH0463153U - - Google Patents
Info
- Publication number
- JPH0463153U JPH0463153U JP10422190U JP10422190U JPH0463153U JP H0463153 U JPH0463153 U JP H0463153U JP 10422190 U JP10422190 U JP 10422190U JP 10422190 U JP10422190 U JP 10422190U JP H0463153 U JPH0463153 U JP H0463153U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- semiconductor element
- lead frame
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10422190U JPH0463153U (fi) | 1990-10-03 | 1990-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10422190U JPH0463153U (fi) | 1990-10-03 | 1990-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463153U true JPH0463153U (fi) | 1992-05-29 |
Family
ID=31849424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10422190U Pending JPH0463153U (fi) | 1990-10-03 | 1990-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463153U (fi) |
-
1990
- 1990-10-03 JP JP10422190U patent/JPH0463153U/ja active Pending