JPH0463147U - - Google Patents

Info

Publication number
JPH0463147U
JPH0463147U JP10539790U JP10539790U JPH0463147U JP H0463147 U JPH0463147 U JP H0463147U JP 10539790 U JP10539790 U JP 10539790U JP 10539790 U JP10539790 U JP 10539790U JP H0463147 U JPH0463147 U JP H0463147U
Authority
JP
Japan
Prior art keywords
mold
protruded
package
utility
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10539790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10539790U priority Critical patent/JPH0463147U/ja
Publication of JPH0463147U publication Critical patent/JPH0463147U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10539790U 1990-10-04 1990-10-04 Pending JPH0463147U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10539790U JPH0463147U (US20090163788A1-20090625-C00002.png) 1990-10-04 1990-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10539790U JPH0463147U (US20090163788A1-20090625-C00002.png) 1990-10-04 1990-10-04

Publications (1)

Publication Number Publication Date
JPH0463147U true JPH0463147U (US20090163788A1-20090625-C00002.png) 1992-05-29

Family

ID=31851067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10539790U Pending JPH0463147U (US20090163788A1-20090625-C00002.png) 1990-10-04 1990-10-04

Country Status (1)

Country Link
JP (1) JPH0463147U (US20090163788A1-20090625-C00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088352A (ja) * 2007-10-01 2009-04-23 Denso Corp 電子回路装置の製造方法および電子回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088352A (ja) * 2007-10-01 2009-04-23 Denso Corp 電子回路装置の製造方法および電子回路装置
JP4518128B2 (ja) * 2007-10-01 2010-08-04 株式会社デンソー 電子回路装置の製造方法および電子回路装置

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