JPH0463129U - - Google Patents
Info
- Publication number
- JPH0463129U JPH0463129U JP10479890U JP10479890U JPH0463129U JP H0463129 U JPH0463129 U JP H0463129U JP 10479890 U JP10479890 U JP 10479890U JP 10479890 U JP10479890 U JP 10479890U JP H0463129 U JPH0463129 U JP H0463129U
- Authority
- JP
- Japan
- Prior art keywords
- flange
- bonding wire
- spool
- semiconductor devices
- chromic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Winding Filamentary Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10479890U JPH0463129U (zh) | 1990-10-04 | 1990-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10479890U JPH0463129U (zh) | 1990-10-04 | 1990-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463129U true JPH0463129U (zh) | 1992-05-29 |
Family
ID=31850219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10479890U Pending JPH0463129U (zh) | 1990-10-04 | 1990-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463129U (zh) |
-
1990
- 1990-10-04 JP JP10479890U patent/JPH0463129U/ja active Pending