JPH0461775A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH0461775A JPH0461775A JP16855290A JP16855290A JPH0461775A JP H0461775 A JPH0461775 A JP H0461775A JP 16855290 A JP16855290 A JP 16855290A JP 16855290 A JP16855290 A JP 16855290A JP H0461775 A JPH0461775 A JP H0461775A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- lead
- contact
- socket
- contact piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 3
- 239000000356 contaminant Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
IC試験機等に用いられるICソケットに関し、接触子
とICのリードとの接触不良を改善することを目的とし
、
絶縁物からなるソケット本体に接触部とばね部を有する
多数の接触子が配設され、且つ該接触子にリードを接触
させて載置したICを押圧固定する蓋を有するICソケ
ットにおいて、上記蓋を閉じたときに、接触子のばね部
を押圧して接触部をICのリードに対して摺動させる楔
状の突起を該蓋に設けるように構成する。[Detailed Description of the Invention] [Summary] Regarding IC sockets used in IC testing machines, etc., the purpose of this invention is to improve poor contact between contacts and IC leads. In an IC socket having a lid which is provided with a large number of contacts each having a spring portion, and which presses and fixes an IC placed thereon with leads in contact with the contacts, when the lid is closed, the springs of the contacts The lid is provided with a wedge-shaped protrusion that presses the contact portion and slides the contact portion against the IC lead.
本発明は、IC試験機等に用いられるICソケットに関
する。The present invention relates to an IC socket used in an IC testing machine or the like.
第4図に従来のICソケットを示す。これは0字状のば
ね部2aと該ばね部の一端に形成された接触部2bとを
有する多数の接触子2が配設された絶縁物よりなるソケ
ット本体1と、該ソケット本体1にピン3で開閉自在に
取着された蓋4とにより構成されている。そしてソケッ
ト本体1の接触子2にリード5が接触するようにしてI
C6を載置し、蓋4を閉じることにより、該蓋4に設け
られた突起4aによりICのリード5を接触子2に押圧
するようになっている。FIG. 4 shows a conventional IC socket. This consists of a socket body 1 made of an insulator on which a large number of contacts 2 having a 0-shaped spring part 2a and a contact part 2b formed at one end of the spring part are arranged, and a pin on the socket body 1. 3 and a lid 4 attached to the lid 4 so as to be openable and closable. Then, the lead 5 is brought into contact with the contact 2 of the socket body 1.
By placing the C6 and closing the lid 4, the IC leads 5 are pressed against the contacts 2 by the projections 4a provided on the lid 4.
上記従来のICソケットでは、その接触子2とIC6の
リード5との接触は、蓋4の突起4aにより、リード5
を介して押圧された接触子2のばね部分2aの撓みによ
る反撥力のみによって接触していた。従って接触面の自
浄作用はなく、接触面の汚れに対して接触不良が起き易
く、そのため、正確な測定を行なうためには頻繁に接触
面を洗浄する必要があるという問題があった。In the above-mentioned conventional IC socket, the contact between the contact 2 and the lead 5 of the IC 6 is established by the protrusion 4a of the lid 4.
The contact was made only by the repulsive force caused by the deflection of the spring portion 2a of the contactor 2 that was pressed through the contactor 2. Therefore, there is no self-cleaning effect on the contact surface, and contact failure is likely to occur due to dirt on the contact surface, which poses a problem in that the contact surface must be frequently cleaned in order to perform accurate measurements.
本発明は上記従来の問題点に鑑み、接触子とICのリー
ドとの接触不良を改善したICソケットを提供すること
を目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, it is an object of the present invention to provide an IC socket in which poor contact between a contactor and an IC lead is improved.
〔課題を解決するための手段〕
上記目的を達成するために本発明のICソケットでは、
絶縁物からなるソケット本体10に接触部11bとばね
部11aを有する多数の接触子11が配設され、且つ該
接触子11にリード14を接触させて載置したICl3
を押圧固定する蓋13を有するICソケットにおいて、
上記蓋13を閉じたときに、接触子11のばね部11a
を押圧して接触部11bをICのり−ド14に対して摺
動させる楔状の突起16を該蓋13に設けたことを特徴
とする。[Means for Solving the Problem] In order to achieve the above object, the IC socket of the present invention has the following features:
A large number of contacts 11 having contact portions 11b and spring portions 11a are disposed on a socket body 10 made of an insulating material, and a lead 14 is placed in contact with the contacts 11.
In an IC socket having a lid 13 that presses and fixes the
When the lid 13 is closed, the spring portion 11a of the contact 11
The lid 13 is characterized in that a wedge-shaped projection 16 is provided on the lid 13 for pressing the contact portion 11b to slide the contact portion 11b against the IC board 14.
ソケット本体10にICl3を収容し、蓋13を閉じる
ときに該蓋13に設けられた楔状の突起16が接触子1
1のばね部11aを押圧するため、該接触子11の接触
部11bはICのリード14に接触したまま摺動する。When ICl3 is accommodated in the socket body 10 and the lid 13 is closed, the wedge-shaped protrusion 16 provided on the lid 13 contacts the contact 1.
In order to press the spring portion 11a of the contactor 11, the contact portion 11b of the contactor 11 slides while being in contact with the lead 14 of the IC.
この摺動によりリード14と接触部11bは摩擦して接
触部11bの汚れを除去することができる。This sliding causes friction between the lead 14 and the contact portion 11b, and dirt can be removed from the contact portion 11b.
第1図は本発明の実施例を示す図である。 FIG. 1 is a diagram showing an embodiment of the present invention.
本実施例は同図に示すように、U字状のばね部11aと
該ばね部の一端に形成された接触部11bとを有する多
数の接触子11が配設された絶縁物よりなるソケット本
体10と、該ソケット本体10にピン12で開閉自在に
取着され、且つ接触子11にリード14が接触するよう
にして載置されたICl3のリード14を押圧する突起
13aを有する蓋13とよりなることは第4図で説明し
た従来例と同様であり、本実施例の要点は、蓋13を閉
じたときに、接触子11のばね部11aを押圧する楔状
の突起16を設けたことである。As shown in the figure, in this embodiment, a socket body made of an insulator is provided with a large number of contacts 11 having a U-shaped spring part 11a and a contact part 11b formed at one end of the spring part. 10, and a lid 13 which is attached to the socket main body 10 with a pin 12 so as to be freely openable and closable, and has a projection 13a that presses the lead 14 of the ICl 3 placed so that the lead 14 contacts the contactor 11. This is the same as the conventional example explained in FIG. be.
このように構成された本実施例の作用を第2図により説
明する。同図において第1図と同一部分は同一符号を付
して示した。The operation of this embodiment configured as described above will be explained with reference to FIG. In this figure, the same parts as in FIG. 1 are designated by the same reference numerals.
a図は接触子11の接触部11bにリード14が接触す
るようにしてICl3を載置して蓋13を閉じて行き、
完全に閉じる少し前の状態を示している。In Figure a, the ICl 3 is placed so that the lead 14 is in contact with the contact portion 11b of the contactor 11, and the lid 13 is closed.
This shows the state just before it completely closes.
ICl3のリード14は蓋13のリード押え用の突起1
3aと接触子11の接触部11bの間に挟まれている。The lead 14 of ICl3 is attached to the lead holding protrusion 1 on the lid 13.
3a and the contact portion 11b of the contactor 11.
蓋13の楔状の突起16は接触子11のばね部11aに
接触し始めるところである。The wedge-shaped protrusion 16 of the lid 13 is about to start contacting the spring portion 11a of the contactor 11.
a図の状態から蓋13を完全に閉じた状態がb図である
。a図からb図(蓋13の元の位置を2点鎖線で示す。Figure b shows a state in which the lid 13 is completely closed from the state shown in figure a. Figures a to b (the original position of the lid 13 is shown with a chain double-dashed line).
)に移る過程でリード14を押圧する突起13aはリー
ド14を接触子11の接触部11bに押圧する。同時に
楔状の突起16がその斜面16aで接触子11のばね部
11aを矢印A方向に押圧する。これにより接触子11
はそのばね部11aで撓み、接触部11bを矢印A方向
に移動させる。このときICl3のリード14は突起1
3aにより接触子11の接触部11bに押圧されている
ため、接触部11bはリード14に接触しながら摺動す
る。この摺動により接触部11bの接触面の汚れは除去
される。このようにしてICを挿脱する毎に接触面は清
掃される。), the protrusion 13a that presses the lead 14 presses the lead 14 against the contact portion 11b of the contactor 11. At the same time, the wedge-shaped protrusion 16 presses the spring portion 11a of the contactor 11 in the direction of arrow A with its slope 16a. As a result, the contact 11
is bent by its spring portion 11a, and moves the contact portion 11b in the direction of arrow A. At this time, the lead 14 of ICl3 is connected to the protrusion 1
Since the contact portion 11b of the contactor 11 is pressed by the contact member 3a, the contact portion 11b slides while contacting the lead 14. This sliding action removes dirt from the contact surface of the contact portion 11b. In this way, the contact surface is cleaned every time an IC is inserted or removed.
第3図は本発明の他の実施例を示す図である。FIG. 3 is a diagram showing another embodiment of the present invention.
同図において第1図と同一部分は同一符号を付して示し
た。In this figure, the same parts as in FIG. 1 are designated by the same reference numerals.
本実施例が前実施例と異なるところは、蓋13に設けら
れた楔状突起16の斜面に図の如く円弧状の突起17を
設けたことで、他は前実施例と同様である。This embodiment differs from the previous embodiment in that an arc-shaped projection 17 is provided on the slope of the wedge-shaped projection 16 provided on the lid 13, as shown in the figure, and the rest is the same as the previous embodiment.
このように構成された本実施例は、蓋を閉じることによ
り円弧状の突起17が接触子11のばね部11aを矢印
A方向に押圧し、さらに突起17とばね部11aとの接
触点が円弧状の突起を乗り越えた以後は矢印B方向に戻
るため、接触子11の接触部11bは蓋13を1回閉じ
る毎に往復動作し、清掃効果をさらに向上することがで
きる。In this embodiment configured as described above, when the lid is closed, the arcuate protrusion 17 presses the spring portion 11a of the contact 11 in the direction of arrow A, and the contact point between the protrusion 17 and the spring portion 11a is circular. After getting over the arc-shaped protrusion, the contact portion 11b of the contact 11 moves back and forth each time the lid 13 is closed, and the cleaning effect can be further improved.
第3図は本発明の他の実施例を示す図、第4図は従来の
ICソケットを示す図である。FIG. 3 is a diagram showing another embodiment of the present invention, and FIG. 4 is a diagram showing a conventional IC socket.
図において、
10はコネクタ本体、 11は接触子、11aはばね部
、 11bは接触部、13は蓋、 1
4はリード、15はIC,16は楔状の突起、
17は円弧状の突起
を示す。In the figure, 10 is the connector body, 11 is the contact, 11a is the spring part, 11b is the contact part, 13 is the lid, 1
4 is a lead, 15 is an IC, 16 is a wedge-shaped projection, and 17 is an arc-shaped projection.
以上説明したように、本発明によれば、蓋の開閉により
接触子の接触部を摺動させることにより、ICのリード
との摩擦頻度を高めることができ、接触不良の改善を図
ることができる。As explained above, according to the present invention, by sliding the contact portion of the contact by opening and closing the lid, the frequency of friction with the IC lead can be increased, and poor contact can be improved. .
第1図は本発明の実施例を示す図、 第2図は本発明の実施例の作用を説明するための図、 FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram for explaining the operation of the embodiment of the present invention,
Claims (1)
1b)とばね部(11a)を有する多数の接触子(11
)が配設され、且つ該接触子(11)にリード(14)
を接触させて載置したIC(15)を押圧固定する蓋(
13)を有するICソケットにおいて、上記蓋(13)
を閉じたときに、接触子(11)のばね部(11a)を
押圧して接触部(11b)をICのリード(14)に対
して摺動させる楔状の突起(16)を該蓋(13)に設
けたことを特徴とするICソケット。 2、請求項1記載のICソケットにおいて、楔状の突起
(16)の斜面に円弧状の突起(17)を設け接触子の
接触部(11b)を往復摺動させるようにしたことを特
徴とするICソケット。[Claims] 1. A socket body (10) made of an insulator is provided with a contact portion (1
1b) and a large number of contacts (11
) is arranged, and the contact (11) is provided with a lead (14).
A lid (
13), the lid (13)
When the lid (13) is closed, a wedge-shaped protrusion (16) that presses the spring portion (11a) of the contactor (11) and slides the contact portion (11b) against the IC lead (14) is attached to the lid (13). ). 2. The IC socket according to claim 1, characterized in that an arc-shaped projection (17) is provided on the slope of the wedge-shaped projection (16) so that the contact portion (11b) of the contactor can slide back and forth. IC socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16855290A JPH0461775A (en) | 1990-06-28 | 1990-06-28 | Ic socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16855290A JPH0461775A (en) | 1990-06-28 | 1990-06-28 | Ic socket |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0461775A true JPH0461775A (en) | 1992-02-27 |
Family
ID=15870143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16855290A Pending JPH0461775A (en) | 1990-06-28 | 1990-06-28 | Ic socket |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0461775A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547608B2 (en) | 2000-06-07 | 2003-04-15 | Yazaki Corporation | Receptacle terminal and connection structure thereof with pin terminal |
JP2010003862A (en) * | 2008-06-20 | 2010-01-07 | Furukawa Electric Co Ltd:The | Connection structure of electronic parts |
US10777926B2 (en) | 2017-02-22 | 2020-09-15 | Autonetworks Technologies, Ltd. | Multi-contact terminal |
-
1990
- 1990-06-28 JP JP16855290A patent/JPH0461775A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547608B2 (en) | 2000-06-07 | 2003-04-15 | Yazaki Corporation | Receptacle terminal and connection structure thereof with pin terminal |
JP2010003862A (en) * | 2008-06-20 | 2010-01-07 | Furukawa Electric Co Ltd:The | Connection structure of electronic parts |
US10777926B2 (en) | 2017-02-22 | 2020-09-15 | Autonetworks Technologies, Ltd. | Multi-contact terminal |
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