JPH0461304U - - Google Patents
Info
- Publication number
- JPH0461304U JPH0461304U JP10455990U JP10455990U JPH0461304U JP H0461304 U JPH0461304 U JP H0461304U JP 10455990 U JP10455990 U JP 10455990U JP 10455990 U JP10455990 U JP 10455990U JP H0461304 U JPH0461304 U JP H0461304U
- Authority
- JP
- Japan
- Prior art keywords
- fixing member
- thermal conductivity
- base plate
- optical fiber
- calcm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims 10
- 229910001369 Brass Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims 1
- 239000010956 nickel silver Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図は本考案の実施例を示す光フアイバモジ
ユールの断面図、第２図は、本考案の実施例を示
す光フアイバモジユールをパツケージに実装した
断面図、第３図は従来の光フアイバモジユールの
断面図である。
１１……レーザダイオード（ＬＤ）、１２……
ヒートシンク、１３……ＬＤヘツダ、１４……ベ
ースプレート、１５……光フアイバ固定台、１６
……光フアイバ、１７……半田、２０……パツケ
ージ、２１……モニタ用フオトダイオード。
Fig. 1 is a sectional view of an optical fiber module showing an embodiment of the present invention, Fig. 2 is a sectional view of an optical fiber module mounted in a package showing an embodiment of the invention, and Fig. 3 is a sectional view of a conventional optical fiber module. FIG. 2 is a cross-sectional view of a fiber module. 11... Laser diode (LD), 12...
Heat sink, 13...LD header, 14...Base plate, 15...Optical fiber fixing stand, 16
...Optical fiber, 17...Solder, 20...Package, 21...Monitor photodiode.
Claims (1)
１の固定部材を介して固定されたレーザダイオー
ドと、前記ベースプレートに第２の固定部材を介
して固定された光フアイバとを備え、前記レーザ
ダイオードと光フアイバとを光学的に結合するよ
うにした光フアイバモジユールにおいて、 前記第１の固定部材と第２の固定部材とを別体
に構成するとともに、前記第１の固定部材は熱伝
導率の高い材料で、前記第２の固定部材は熱伝導
率の低い材料で、前記ベースプレートは前記第１
の固定部材の熱伝導率と前記第２の固定部材の熱
伝導率との中間の熱伝導率の材料で、かつ前記各
材料の線膨張係数が近似した材料で構成すること
を特徴とする光フアイバモジユール。 (2) 前記第１の固定部材は、熱伝導率が０．８
〜１．１ｃａｌcm−１Ｓ−１Ｋ−１の材料であり
、前記第２の固定部材は、熱伝導率が０．０３〜
０．１０ｃａｌcm−１Ｓ−１Ｋ−１の材料であり
、前記ベースプレートは、熱伝導率が０．２５〜
０．５ｃａｌcm−１Ｓ−１Ｋ−１の材料であり、
かつ、前記各材料の線膨張係数が、１５〜２０×
１０−６Ｋ−１である請求項１記載の光フアイバ
モジユール。 (3) 前記第１の固定部材は、電気銅であり、前
記第２の固定部材は、キユプロニツケルもしくは
洋白であり、前記ベースプレートは、黄銅である
請求項２記載の光フアイバモジユール。[Claims for Utility Model Registration] (1) A base plate, a laser diode fixed to the base plate via a first fixing member, and an optical fiber fixed to the base plate via a second fixing member. The optical fiber module is configured to optically couple the laser diode and the optical fiber, wherein the first fixing member and the second fixing member are configured separately, and the first fixing member and the second fixing member are configured separately. The member is made of a material with high thermal conductivity, the second fixing member is made of a material with low thermal conductivity, and the base plate is made of a material with low thermal conductivity.
A light comprising a material having a thermal conductivity intermediate between the thermal conductivity of the fixing member and the thermal conductivity of the second fixing member, and a material having a linear expansion coefficient similar to that of each of the materials. FAIBA MODULE. (2) The first fixing member has a thermal conductivity of 0.8.
The second fixing member is made of a material with a thermal conductivity of 0.03 to 1.1 calcm −1 S −1 K −1.
The base plate is made of a material with a thermal conductivity of 0.10 calcm −1 S −1 K −1 and a thermal conductivity of 0.25 to
0.5 calcm −1 S −1 K −1 material,
And the linear expansion coefficient of each material is 15 to 20×
10-6 K - 1. (3) The optical fiber module according to claim 2, wherein the first fixing member is made of electrolytic copper, the second fixing member is made of Cypronickel or nickel silver, and the base plate is made of brass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455990U JPH0461304U (en) | 1990-10-05 | 1990-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455990U JPH0461304U (en) | 1990-10-05 | 1990-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0461304U true JPH0461304U (en) | 1992-05-26 |
Family
ID=31849886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10455990U Pending JPH0461304U (en) | 1990-10-05 | 1990-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0461304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010110068A1 (en) * | 2009-03-25 | 2010-09-30 | 古河電気工業株式会社 | Semiconductor laser module and manufacturing method therefor |
-
1990
- 1990-10-05 JP JP10455990U patent/JPH0461304U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010110068A1 (en) * | 2009-03-25 | 2010-09-30 | 古河電気工業株式会社 | Semiconductor laser module and manufacturing method therefor |
| CN102272648A (en) * | 2009-03-25 | 2011-12-07 | 古河电气工业株式会社 | Semiconductor laser module and manufacturing method therefor |
| JP5203505B2 (en) * | 2009-03-25 | 2013-06-05 | 古河電気工業株式会社 | Semiconductor laser module and method for manufacturing semiconductor laser module |
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