JPH0460544U - - Google Patents

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Publication number
JPH0460544U
JPH0460544U JP10270990U JP10270990U JPH0460544U JP H0460544 U JPH0460544 U JP H0460544U JP 10270990 U JP10270990 U JP 10270990U JP 10270990 U JP10270990 U JP 10270990U JP H0460544 U JPH0460544 U JP H0460544U
Authority
JP
Japan
Prior art keywords
heating device
heating
configuration diagram
heating element
schematic cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10270990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10270990U priority Critical patent/JPH0460544U/ja
Publication of JPH0460544U publication Critical patent/JPH0460544U/ja
Pending legal-status Critical Current

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  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例による加熱装置の概
略断面構成図、第2図は前記加熱装置が採用され
たスパツタリング装置の概略断面構成図、第3図
は本考案の他の実施例による加熱装置の概略構成
図、第4図は本考案のさらに他の実施例による加
熱装置を適用した縦型2面方式のスパツタリング
装置の概略断面構成図、第5図は第4図の実施例
のさらに変形例を示す加熱装置の概略断面構成図
、第6図はランプヒータによる従来の加熱装置の
構成図、第7図はシーズヒータを用いた従来の加
熱装置の一部断面構成図である。 2……発熱体、3a,3b……絶縁体。
FIG. 1 is a schematic cross-sectional configuration diagram of a heating device according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional configuration diagram of a sputtering apparatus in which the heating device is adopted, and FIG. 3 is a schematic cross-sectional configuration diagram of a sputtering device according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional diagram of a vertical two-sided sputtering device to which a heating device according to yet another embodiment of the present invention is applied, and FIG. 5 is a schematic diagram of a heating device according to the embodiment of FIG. Further, FIG. 6 is a schematic cross-sectional configuration diagram of a heating device showing a modified example, FIG. 6 is a configuration diagram of a conventional heating device using a lamp heater, and FIG. 7 is a partial cross-sectional configuration diagram of a conventional heating device using a sheathed heater. 2... Heating element, 3a, 3b... Insulator.

Claims (1)

【実用新案登録請求の範囲】 真空室内で加熱を行うための加熱装置であつて
、 発熱体と、 前記発熱体を両側から挟み込むように配置され
、赤外線が透過可能な絶縁体と、 を備えた加熱装置。
[Claims for Utility Model Registration] A heating device for heating inside a vacuum chamber, comprising: a heating element; and an insulator arranged to sandwich the heating element from both sides and through which infrared rays can pass. heating device.
JP10270990U 1990-09-27 1990-09-27 Pending JPH0460544U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10270990U JPH0460544U (en) 1990-09-27 1990-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10270990U JPH0460544U (en) 1990-09-27 1990-09-27

Publications (1)

Publication Number Publication Date
JPH0460544U true JPH0460544U (en) 1992-05-25

Family

ID=31847188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10270990U Pending JPH0460544U (en) 1990-09-27 1990-09-27

Country Status (1)

Country Link
JP (1) JPH0460544U (en)

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